TSMC to Expand Fab, R&D

HSINCHU, Taiwan — TSMC (NYSE: TSM) today held a meeting of the Board of Directors, which passed the following resolutions:

1. Approved capital appropriations of US$1,880.9 million to set up mini-lines for the wafer fab in Taichung, and to expand advanced technology capacity, twelve-inch capacity for wafer-level chip-scale packaging, and specialty technology capacity.

2. Approved 2011 R&D and sustaining capital appropriation of US$803.76 million.

3. Approved capital injection of 9.4 million euros into TSMC Solar Europe B.V.

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