Richardson RFPD Debuts IN FOCUS Magazine

Richardson RFPD, Inc. today announced the debut of a new publication, IN FOCUS magazine. The first issue features machine-to-machine (M2M), reflecting the Company’s extensive commitment to the M2M market. Richardson RFPD offers a broad range of M2M wireless connectivity products, from low cost embedded modules to full-function gateway solutions designed to address diverse applications, such…

Huawei Awards TDK

TDK Corp. announces that its subsidiary, EPCOS Limited in China, has received the Excellent Service Award 2012 from Huawei Device Co. Ltd., a leading Chinese manufacturer of mobile handsets and network terminals. The award recognizes outstanding performance in the areas of customer service and on-time delivery. The EPCOS products supplied to Huawei Device include SAW…

TDK Recognizes Future Electronics

TDK Corporation recognized Future Electronics for its outstanding sales growth in the fiscal year 2013. The company was presented with the Sales Achievement award during the EDS 2013 trade show held at The Cosmopolitan Las Vegas. The award, which was presented to Future Electronics’ top management on May 8th, recognizes the distributor’s significant sales growth…

Avnet Executive to Keynote Interlog 2013 Conference

Manufacturers face a variety of challenges when it comes to their  aftermarket supply chain and how to improve basic customer service.  Lalit Wadhwa, senior vice president, global supply chain operations at Avnet  Electronics Marketing, an operating group of Avnet,  Inc.  will address those issues as a keynote presenter during the upcoming  Next Generation Interlog 2013 Conference. The Next Generation…

UMC Joins IBM Chip Alliance

IBM (IBM) and United Microelectronics Corporation, a leading global semiconductor foundry, today announced that UMC will join the IBM Technology Development Alliances as a participant in the group’s development of 10nm CMOS process technology. “Established over a decade ago, the IBM alliance allows the partners to leverage our combined expertise and collaborative research and innovative technology…