Chandler, Ariz. − Isola Group S.a.r.l. has developed a halogen-free, ultra-low-loss laminate and prepreg material for RF, microwave, and high-speed applications. The TerraGreen halogen-free materials for multilayer printed circuit boards (PCBs) target high-performance designs including power amplifier boards for 4G LTE base stations, Internet infrastructure, and cloud computing. Isola Group, a material sciences company, manufactures copper-clad laminates and dielectric prepreg materials used to fabricate advanced multilayer PCBs.
“Electronics manufacturers have long-expressed the need for halogen-free, ultra-low loss, lead-free assembly material for high-speed digital and RF/microwave markets,” said Tarun Amla, executive vice president and chief technology officer, Isola, in a statement. “Isola’s investments in R&D have successfully resolved this issue with our proprietary TerraGreen resin system.”
The TerraGreen portfolio consists of a full offering of cores and prepreg that use spread-glass fabric. The dielectric constant (ranging from 3.00 to 3.45) and dissipation factor (ranging from 0.0030 to 0.0035) remain stable over a wide range of frequencies and temperatures, according to Isola. Core thicknesses are available from 0.002″ to 0.018″, 0.020″, 0.030″ and 0.060″.
The lead-free assembly material is said to be easy to process. The high-performance and halogen-free material uses a short-lamination cycle; is easy to drill, and does not require plasma desmear. The prepreg shelf life is similar to FR-4 materials.
TerraGreen is suitable for high-layer count, high-speed digital, backplanes, and is compatible with Isola’s FR-4 materials for hybrid designs.