Tokyo, Japan −TDK Corp. has expanded its multilayer ceramic chip (MLCC) family with the introduction of the CGA3EA series of automotive-grade components. These MLCCs meet the electrostatic discharge (ESD) immunity requirements according to the IEC 61000-4-2 standard. Automotive electronics applications include airbag controllers, remote keyless entry systems, and navigation systems.
The series is comprised of two dielectric lines with different thermal characteristics. The C0G components offer a temperature range of -55°C to +125°C and a temperature coefficient of 0 ±30 ppm/°C max., and the NP0 components provide a temperature range of -55°C to +150°C with the same temperature coefficient.
The material used in the CGA3EA series features a low dielectric constant so it maintains stable performance even when load conditions such as temperature or voltage change, said TDK. The components withstand ESD events of up to 8 kV and higher, as proven by the contact discharge test according to IEC 61000-4-2 (level 4).
Availability: Mass production of the CGA3EA series, qualified to AEC-Q200, started in October 2013.