Bourns, Inc., a leading manufacturer and supplier of electronic components, today announced the addition of 3D, SPICE model, S-Parameter and LTspice files to the company’s website. Beneficial for circuit modeling and to simulate device performance, Bourns offers its 3D model files in IGS and STP formats, SPICE Model files in TXT or DOC formats, S-Parameter files in S2P formats, and LTspice files in LIB formats. Bourns has also made it easy for designers to find the new files by placing them in three locations on its homepage: on the “Data Sheet” search, from individual product pages and by clicking the “Design Files” button.
Bourns provides 3D model files on most of its product lines. SPICE model files are currently available for several Bourns® TBU® high-speed protectors (TXT), TVS diodes (DOC), and is offering S-Parameter (S2P) and LTspice (LIB) files for many of its inductor products. By supplying its SPICE files with the Bourns® component’s critical specifications, engineers can simply load them into the program, test their circuit and make an informed decision about the device in their application. Compared to taking this essential information from the data sheet, access to these new design tools allows engineers to speed prototyping and application development, thus saving consideration time and costs.
Bourns, Inc. is a leading manufacturer and supplier of automotive sensors, circuit protection solutions, magnetic products, microelectronic modules, trimming and precision potentiometers, panel controls and encoders and resistive products. Headquartered in Riverside, CA, Bourns serves a broad range of markets, including telecommunications, automotive, consumer, non-critical life support medical, audio and various other market segments. Bourns® products are manufactured according to ISO-9000 and ISO-14001 standards under Six Sigma quality programs. Additional company and product information is available at the company’s website at http://www.bourns.com.