Here are the top ten most read articles about the interconnect, passive and electromechanical (IP&E) device market in 2013.
The global market for flip chip technology is expected to grow from $18.9 billion in 2012 to $20.1 billion in 2013, according to BCC Research.
The addition of Sunbank to Esterline’s Connection Technologies platform, which includes SOURIAU, will strengthen their portfolio in the European and North American aerospace markets.
Atmel and Hillcrest Labs have expanded their collaboration to deliver turn-key sensor hub solutions.
An ERP survey sponsored by Epicor Software reveals barriers between high-tech manufacturing companies not using modern ERP solutions to full capacity.