IPC – Association Connecting Electronics Industries® released a global survey this month to collect data for the IPC International Technology Roadmap for Electronic Interconnections, and for IPC’s 2014 Technology Trends Study. Participation is open to all manufacturers of printed circuit boards and board assemblies worldwide. The deadline for survey responses is January 31.
The survey covers key technical issues in both fabrication and assembly of PCBs, including topics such as clock speed, heat dissipation, layer counts, embedding, aspect ratios, I/O pitch and component size. Respondents may answer the questions that relate to their type of operation, focusing on specific end-use applications.
Survey participants will receive the 2014 Technology Trends Study at no charge and before it becomes available for sale. In addition, the first 100 people to submit a valid and usable survey will receive a free copy of the 2015 IPC Technology Roadmap. The study and Roadmap are published every two years.
Manufacturers interested in contributing to the survey can contact Piyamart Holmgren at PiyamartHolmgren@ipc.org or +1 847-597-2868 for the access and company codes.