Sunnyvale, Calif. — Spansion Inc. is launching the first family of products based on its Spansion HyperBus Interface, claimed as a breakthrough for improving read performance while reducing the number of pins. The Spansion HyperFlash NOR memory devices deliver read throughput of up to 333 megabytes per second—more than five times faster than traditional Quad SPI flash currently available with one-third the number of pins of parallel NOR flash.
The efficient 12-pin Spansion HyperBus Interface consists of an 8-pin address/data bus, a differential clock (2 signals), one Chip Select and a Read Data Strobe for the controller, reducing the overall cost of the system, said Spansion. The new interface is expected to enable a wide range of high-performance applications, such as automotive instrument clusters, infotainment/ navigation systems, advanced driver assistance systems (ADAS), hand-held displays, digital cameras, projectors, factory automation, medical diagnostic equipment, and home automation appliances.
“For several years now, SPI flash has been a popular low-pin-count solution for reducing system costs and board space,” said Robin Jigour, Senior Vice President of the Flash Memory Business Group, Spansion, in a statement. “Spansion’s HyperBus Interface gives embedded designers a new level of performance and pin-count efficiency. The Spansion HyperBus Interface allows for much faster boot time, direct execute-in-place from flash and less code shadowing, reducing the amount of RAM needed.”
These devices provide a migration path—from single Quad SPI to Dual Quad SPI to HyperFlash Memory—allowing system applications to be scaled to different levels of flash performance when paired with compatible controllers, giving OEMs the ability to offer different product models with a single design, said Spansion.
The Spansion HyperBus Interface is being implemented by leading system-on-chip (SoC) manufacturers.
Availability: The Spansion HyperFlash Memory family will offer 3V and 1.8V power-supply versions and initially include three densities: 128Mb, 256Mb and 512Mb. The 512Mb devices are sampling in the second quarter of 2014. HyperFlash memories will be available in an 8- x 6-mm ball grid array (BGA) package.