Toshiba Corporation’s (TOKYO:6502) Semiconductor & Storage Products Company today announced that it will start from today, sample shipments of 32-gigabyte and 64-gigabyte (GB) embedded NAND flash memory modules compliant with the JEDEC UFS Ver.2.0 standard, the first company in the industry to do so. The modules also integrate 5.8Gbps High-speed MIPI® M-PHY® HS-G3 I/F, which is an optional feature of the UFS Ver. 2.0 standard, and achieve ultra-high performance, including 650MB/s read speed and 180MB/s write speed.
The faster transfer speeds can shorten the time taken to launch many kinds of applications, shoot digital still images, and play and download large data movie and music files on mobile products like smartphones or tablet PCs.
Demand continues to grow for large density, high-performance chips that support high resolution video, driven by improved data-processing speeds in host chipsets and wider bandwidths for wireless connectivity in a wide range of digital consumer products, including smartphones and tablet PCs.
Toshiba has proved itself an innovator in this key area, and is now reinforcing its leadership by being first in the industry to deliver samples with a high performance UFS module.
Toshiba will schedule mass production and add other densities to the line-up in response to market demand.