Omnetics Unveils Rugged Metal Nano-Connectors

Omnetics Connector Corp. has announced a new line of Metal Nano-Connectors. These interconnects are high-density, multi-position connectors made with break-away or threaded metal housings for a positive lock and environmental seal. Built to meet or exceed military specifications, the small, lightweight connectors target mission-critical applications where size, weight and reliability are critical, such as onboard unmanned…

Industry Leaders Launch Consortium to Drive IoT Standards

Santa Clara, Calif. – Technology industry leaders – Atmel, Broadcom, Dell, Intel, Samsung Electronics, and Wind River – have joined together to form a new industry consortium to develop a connectivity framework that is open, secure and manageable for the products that make up the Internet of Things (IoT). The focus of the Open Interconnect Consortium (OIC) is to define a common…

CEVA Acquires RivieraWaves

Mountain View, Calif. – CEVA, Inc. (NASDAQ: CEVA), the leading licensor of DSP-based IP platforms for vision, audio, communications and connectivity, today announced that it has acquired RivieraWaves, a privately held company and a leading provider of wireless connectivity IP for Wi-Fi® and Bluetooth®  technologies. RivieraWaves expands CEVA’s licensing and royalty revenue base in its…

NKK Switches Awards Heilind Distributor of the Year

Wilmington, Mass. — Heilind Electronics, the largest interconnect distributor in North America, has received the Distributor of the Year Award for 2013 from NKK Switches. The award was presented to Heilind at the annual Electronics Distribution Show and Conference in Las Vegas in May. “It is an incredible honor to be named NKK’s distributor of the year,” says Keith…

Richardson RFPD Signs Radius Power

LaFox, Ill. – Richardson RFPD, Inc. announced today that it has completed an agreement with Radius Power, Inc. to distribute EMI power line filters. Radius Power offers a broad selection of EMI/EMC power line filters, including standardized and custom solutions that help meet international compliance standards and improve the immunity and safety of electrical and electronic equipment.…

Lam Unveils New Capabilities for 3D NAND Fabrication

San Francisco, Calif. – Lam Research Corp. (NASDAQ:LRCX), a major global supplier of innovative wafer fabrication equipment and services to the semiconductor industry, today unveiled its latest thin film deposition and plasma etch products for 3D NAND fabrication. As memory customers begin ramping production of these new devices, greater process control is needed for cost-effective manufacturing.…