Molex Acquires SDP Telecom

Lisle, Ill. – Molex Incorporated, a leading global interconnect and cable assembly provider, announced that it and certain of its affiliates have acquired SDP Telecom.  Headquartered in Montreal, Canada, SDP designs and manufactures RF/microwave solutions for the wireless communications industry. “Together, Molex and SDP will broaden our RF/Microwave product capabilities and create additional value for our customers…

Thermal Analysis Paper Released

RFMW, Ltd. announces the availability of a new White Paper from TriQuint (Qorvo) titled GaN Thermal Analysis for High-Performance Systems. This paper addresses the TriQuint (Qorvo) integrated approach to thermal design that leverages modeling, empirical measurements (including micro-Raman thermography), and finite element analysis (FEA) for high performance microwave GaN HEMT devices and MMICs. This methodology…

NEXCOM Delivers Industrial IoT Gateways, Controllers

Seoul, South Korea — NEXCOM has released the NISE 3720 series industrial IoT gateways and controllers for smart manufacturing. Supporting 5th generation Intel® Core™ processors, the NISE 3720 series provides enhanced computing and graphics capabilities. Adding the support for cross-protocol communication capability, the NISE 3720 series connects factories, enabling intensive data analysis of a data…

Imagination Debuts Imaging Framework for Android

CES – Las Vegas – Imagination Technologies (IMG.L) announces a new PowerVR imaging framework for Android: a set of software components that allow OEMs to integrate the latest computational photography and computer vision features into their camera applications, leveraging the inherent low-power parallelism of the PowerVR Rogue GPU. Advanced vision and computational photography features such as HDR…

Marvell Claims First 802.11ac Wave-2 4×4 Processor

CES – Las Vegas — Marvell has claimed the industry’s first 802.11ac Wave-2 4×4 processor, the Marvell Avastar 88W8964, featuring 160 MHz bandwidth and multi-user, multiple input and multiple output (MU-MIMO) support. With built-in 802.11ac 160 MHz support, the new chip achieves 2.6 Gbps peak data rate making it suitable for high speed enterprise access points and…

Toshiba Unveils Reference Design for Indoor Proximity Apps

CES – Las Vegas –Toshiba America Electronic Components, Inc. (TAEC) offers a complete reference model for indoor proximity applications, or beacons, which use Bluetooth Low Energy (BLE) to communicate signals detectible by smart devices. The TC35670 reference system, housed in a 75- x 35- x 12-mm case, comprises an ultra-low-power BLE component, a best-in-class NFC Type 3…