Sunnyvale, Calif. — Spansion Inc. (NYSE: CODE), a global leader in embedded systems solutions, and XMC, China’s fastest growing 300mm semiconductor foundry, today announced that the two companies will work together to develop and manufacture 3D NAND technology. The companies have signed development and cross-licensing agreements.
According to TechNavio, 3D NAND is expected to grow at a compounded annual growth rate of over 180% by 2018. The increase in memory requirements and demand for low form factors for NAND flash is contributing to this growth.
“The explosion of data created by the rapid growth of the Internet of Things and more advanced automotive systems is placing greater demands on storage technologies. 3D NAND will revolutionize how data will be more efficiently stored in the future,” said Ali Pourkeramati, senior vice president of strategic alliances at Spansion. “Our leading charge trap MirrorBit® technology, which we invented over 10 years ago, will be the key advantage for 3D NAND innovation and will provide unparalleled high-performance data storage.”
“We are pleased to co-develop 3D NAND technology with Spansion,” said Michael Chen, Chief Business Officer of XMC. “XMC will continue to leverage its leading edge manufacturing capabilities, extensive volume production experience with charge trap technology and world-class R&D team in memory expertise. By partnering with Spansion, we are confident to successfully bring innovative 3D NAND technology to market. ”
The first 3D NAND products will be available in 2017.