E2v inc has announced today the release of a stacked-package 32Mb MRAM-based product, which not only offers a significantly decreased package footprint size, but also makes it the highest density MRAM device in the industry.
The EV5A16B is a stacked solution, with two 16Mb MRAM devices from Everspin Technologies and is offered in a 54 pins stacked-package *TSOP. Available in commercial (0°C to 70°C) and Industrial (-40°C to 85°C) temperature ranges, the MRAM technology offers SRAM-compatible, 35-ns read/write timing with data retention and endurance and is used with microprocessors, **DSP, storage systems, instruments, and ***FPGAs.
Brad Little, Vice President and General Manager of e2v inc’s Semiconductor business unit commented, “Our new stacked-package MRAM will have a significant impact on our customers’ systems by addressing the industry requirements for a high-density memory, available in a small footprint with the ability to increase system performance. By improving the size, weight and power (SWaP) of our product you are also talking about major cost savings for the customer.”
The new EV5A16B is available now.
For more information about e2v inc visit www.e2v-us.com
Media Contact: For enquiries about this press release contact: Wallace Scott, Wallace.Scott@e2v-us.com