Boston, Mass. - Thanks to continued innovations silicon-based power electronics is expected to maintain the lion’s share of the global $20 billion market, according to Lux Research. Advances in circuits, controls and packaging will allow silicon to hold on to its 87 percent market while relegating wide-bandgap (WBG) materials to a much smaller share, according to the new research.
The report, “Sorting Through the Maze of Silicon Innovations in Power Electronics,” finds that these innovations will slow adoption of WBG materials in many applications, particularly in the near term because of silicon's high availability and volumes.
“Circuit design innovation will have its biggest impact on space and efficiency improvements in IT and consumer electronics, while control method innovation impacts size reduction across all applications,” said Tiffany Huang, Lux Research Associate and lead author of the report, in a statement. “Innovations in module packing can not only reduce size, but increase the efficiency to be on par with current WBG innovations in transportation markets.”
In a previous report, Lux Research reports that power electronics based on new gallium nitride (GaN) and silicon carbide (SiC) technologies have the potential to significantly improve efficiency but because these materials are higher cost, companies need market-specific strategies to succeed in driving adoption.
The review by Lux analysts finds that TI, Maxim, and Qualcomm are ranked the highest in circuit design based on their partnerships and customers in multiple market segments. Start-up companies ranked as “high-potential” include Ineda, Arctic Sand, Ambiq Micro, Brusa and Alpitronic.
ABB, Dialog, Omron lead in control methods thanks to efficient products and partnerships. Start-up companies ranked as “high-potential” include Varentec, FINsix, Gridco and Cirasys.
In the area of module packaging, Bosch and Schneider Electric take the lead thanks to their strengths in automotive and industrial markets, respectively. The review also indicates that AT&S’ “novel” energy-efficient packaging methods lacks adoption in the market, and AgileSwitch’s digital gate driver success is limited to the United States.