Greenville, S.C. — KEMET Corporation (NYSE: KEM), a leading global supplier of electronic components, honored patent recipients, as well as others who participated in the patent process, during its Patent Awards Luncheon on May 28, 2015. Plaques representing the twenty new patents joined those already on display on the Patent Wall at KEMET’s U.S. Innovation Center in Simpsonville, South Carolina.…
It’s nearly impossible to sum up an executive’s legacy in a single article. There are, of course, executives that will be associated with a single event – such as Dennis Kozlowski – both good and bad. Mark Larson’s career can best be described as steady and consistent. The company he managed for nearly 40 years,…
Austin, Tex. – Tempo Semiconductor Inc. (TSI) unveiled a new low power audio subsystem for portable applications. This new device family – the TSCS422XX – is said to minimize board space and reduce system cost through integration. The new devices are housed in 5-mm x 5-mm and 7-mm x -mm QFN packages. The TSCS422XX is a…
Seoul, Korea – Samsung Electronics Co. Ltd. introduced new chip-on-board (COB) LED packages, including small light emitting surface (LES) COB packages, high color rendering index (CRI) COBs, and vivid COBs. Samsung said the “COB packages offer outstanding color quality and scaled-down light emitting space, will provide a major design alternative for LED lighting makers.” The new…
Rising adoption of electronics across all sections of the global economy is one of the primary drivers of growth in the electronics market and this pace is likely to accelerate in the near future, according to industry executives. This realization is forcing players in the entire supply chain to keep a tab on emerging technologies…