Austin, Tex. – Tempo Semiconductor Inc. (TSI) unveiled a new low power audio subsystem for portable applications. This new device family – the TSCS422XX – is said to minimize board space and reduce system cost through integration. The new devices are housed in 5-mm x 5-mm and 7-mm x -mm QFN packages.
The TSCS422XX is a 24-bit audio CODEC that supports digital or analog MEMS microphones and offers a DSP filter engine that enriches the sound presence through dynamic processing, 12-band Equalizer (EQ), speaker protection, and louder volume when using small speakers. It also incorporates immersive 3D surround, Psychoacoustic Bass, Treble Enhancements and a professional style 3-Band DRC for life-like listening experience in all listening modes, said the company.
The combination of high efficiency 3-watt all digital DDX class D driver, capless DirectConnect headphone and digital signal processing including 12-band equalizer, 3band compressor and Tempo unique Psychoacoustic Bass and Treble processing enhances sound pressure level (SPL) for loudness at minimal power without damage to small form factor speakers, said TSI.
The All-Digital High Efficiency DDX technology offers higher efficiency, consuming less power than traditional binary class-D solutions and works seamlessly with TSI’s Windows (7, 8, 10), Linux, Android software and driver suite, resulting in a significant improvement in battery life, according to the company.
With low standby power of 350 uW, the TSCS42xxx device is well suited for wearables, Internet of things (IoT) and other applications where battery life is critical. In addition, the programmable DSP filter engine is said to enrich the sound presence through dynamics processing, pro-style multiband compressor, 12-band equalization, speaker protection, and louder SPL when using small speakers.
TSI also offers complete driver support and tuning tools for faster time-to-market with Windows, Linux and Android systems.
Availability: The TSI TSCS422xx family is currently sampling to qualified customers.