Riverside, Calif. – Bourns, Inc., a leading manufacturer and supplier of electronic components, today announced its Asia-Pacific operations have received the 2014 Outstanding Supplier Partnership Award from Arrow Electronics’ Asia-Pacific Components business. The award recognizes the outstanding service, quality and on-time delivery performance the Bourns Asia-Pacific team provided to Arrow in 2014. The award was presented…
ams AG, a global manufacturer of high performance sensor solutions and analog ICs, plans to initially invest more than $2 billion to support a 360,000-square-foot wafer fab facility at the Nano Utica site in Marcy, New York. The investment is expected to generate more than 1,000 new jobs. Governor Andrew M. Cuomo’s $1.5 billion Nano…
Mouser Electronics, Inc. is now stocking the AD7124-8 low-power, low-noise analog front end (AFE) from Analog Devices. This completely integrated AFE contains a low-noise, 24-bit sigma-delta (Σ-Δ) analog-to-digital converter (ADC), and can be configured to have eight differential inputs or 15 single-ended or pseudo differential inputs. The AD7124-8 is ideal for designs that require high-precision…
Fort Worth, Tex. – It’s a big day in the world of distribution and The Specialist has teamed up with Ohmite President, Greg Pace, for a press conference to make a very important announcement. The anticipation from the crowd mounts as the news is announced – TTI and Ohmite Manufacturing have partnered to bring ARCOL’s…
Worldwide Smartphone Market Forecast, 2015-2019 research report says while China is expected to occupy a lion’s share of global smartphone market at over 30% in 2015, its share however is predicted to fall below 30% in 2016 and thereafter. Complete report on worldwide smartphone market spread across 16 pages and covering 10 companies while providing data for…
In 2020 flexible barrier manufacturing for flexible electronic devices such as displays will be a market worth more than US$184 million according to IDTechEx Research. That equates to 3.8 million square meters of flexible barrier films for electronics. Although multilayer approaches – usually organic and inorganic layers – have been the most popular solution for flexible…
Oslo, Norway – NEXT Biometrics Group ASA (OSLO:NEXT) announced the introduction of ultra-thin fingerprint sensor designs that remove the need for large bezels, or metallic frames, used in the first generation of NEXT sensors, making them tailored for the design-focused smartphone, tablet and notebook markets. Tore Etholm-Idsoe, CEO of NEXT Biometrics, the leader in high-quality low-cost fingerprint…
According to a new market research report “Solid State Relay Market by mounting (Panel, PCB, DIN Rail), by output (AC, DC, and AC/DC), by application (Building Equipment, Industrial Automation, and Others) and by Geography (North America, Europe, APAC and RoW) – Global forecast to 2020”, published by MarketsandMarkets, the Solid State Relay Market is expected to reach USD 1,138.8 Million by…
Just when the industry thought that things were pretty good in 2013, RF Power Semiconductors for Wireless Infrastructure blew off the charts in 2014. China and the Asia-Pacific region in general continues to be the main driver for the RF Power Semiconductor devices that are sold into the mobile wireless infrastructure segment. According to ABI…
Three new series of heavy-duty interconnects from TE Connectivity (TE), a world leader in connectivity, are now available in Europe through TTI Inc., a world leading specialist distributor of passive, connector, electromechanical and discrete components. TE’s UIC 552, 568 and 541 series of connectors are designed for rail and mass-transit applications. TE’s UIC 552 series…