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San Jose, Calif. – mCube claimed the industry’s first 3-axis MEMS accelerometer that measures less than a cubic millimeter in total size (0.9mm3). Housed in a 1.1- x 1.1- x 0.74-mm package size, the MC3551 is 75 percent smaller than current 2-mm x 2-mm accelerometers, enabling developers to design high-resolution 3-axis inertial solutions for products that require ultra-small sensor form factors, said mCube.
The MC3571 features a wafer level chip scale package (WLCSP), which opens up new design possibilities for the next generation of mobile phones, medical devices, and consumer products, said mCube.
The high-resolution 14-bit, 3-axis MC3571 accelerometer is built on the company’s 3D monolithic single-chip MEMS technology platform, enabling the sensors to be fabricated directly on top of IC electronics in a standard CMOS fabrication facility. Advantages of this monolithic approach include smaller size, higher performance, lower cost, and the ability to integrate multiple sensors onto a single chip, said mCube.
Key features include:
- 8, 10, or 14-bit resolution
- Output Data Rates (ODR) up to 1024Hz;
- Selectable interrupt modes via an I2C bus
- Requires only a single external passive component, compared to competitive offerings requiring 2 or more.
Availability: Samples of the 1.1- x 1.1-mm WLCSP accelerometer are available to select lead customers now with volume production scheduled for the second quarter of 2016.
Pricing: N/A
Resources:
- mCube Company Fact Sheet
- MC3571 Datasheet
- Whitepaper: Advantages of Integrated MEMS to Enable the Internet of Moving Things
