Conexant Completes Audio Testing Facility in Taiwan

Irvine, Calif. – Having recently expanded its presence in Asia Pacific, Conexant Systems Inc., an audio and imaging innovation leader, today announced that it has completed the build out of its new AudioSmart™ test facility in Taipei’s Technology Corridor. By making a significant investment in this new acoustical engineering and test facility in Taipei, Conexant has more than doubled…

Emerging Markets Fuel Smartphone Demand

There is good news for electronics components suppliers in the mobile device sector. Smartphone manufacturers saw healthy demand in the third quarter (Q3) of 2015, which is expected to continue into the fourth quarter. Demand for affordable smartphones in emerging markets fueled worldwide sales of smartphones in Q3 2015, according to Gartner, Inc. Global sales of smartphones…

Qualcomm Names Cristiano Amon President of QCT

Qualcomm Incorporated (NASDAQ: QCOM) today announced that Cristiano Amon has been promoted to executive vice president, Qualcomm Technologies, Inc. and president of QCT, effective immediately. During Amon’s 18-year tenure, his leadership has been instrumental in driving revenue growth in the core business and now the expansion into adjacent areas. This promotion is a recognition of Amon’s unique…

Mouser to Sponsor TI Design Challenge for Engineering Students

Mouser Electronics, Inc., the global authorized distributor with the newest semiconductors and electronic components, today announced that it will sponsor the 2016 North American Texas Instruments Innovation Challenge Design Contest. The design contest is intended to encourage engineering students to solve today’s engineering problems by employing analog and embedded design skills into electronic solutions. The contest offers…

Toshiba Unveils SOI Process for RF Switches

Toshiba Corporation’s (TOKYO:6502) Semiconductor & Storage Products Company today announced the development of “TaRF8”, a next generation TarfSOI™ (Toshiba advanced RF SOI) process optimized for radio-frequency (RF) switch applications that achieves the lowest-class[1] of insertion loss[2] in the industry. Sample shipments of SP12T[3] RF switch ICs for smartphones fabricated with the new process will start in January 2016.…