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Austin, Tex. – Freescale Semiconductor released an ultra-thin version of the Kinetis K22 microcontroller (MCU) with a 120-MHz ARM Cortex-M4 core, 512KB Flash and 128KB SRAM in a package measuring 0.34 millimeters in height. The new device is suited for applications such as chip-and-PIN credit cards, wearables and consumer electronics that require security and small form factors.
Security features include a hardware CRC module, 128-bit unique identification (ID) number per chip, hardware random-number generator, and Flash access control to protect proprietary software. Memory interfaces provided are a FlexBus external bus interface, a serial programming interface (EzPort), and a preprogrammed Kinetis flashloader for one-time, in-system factory programming
Freescale said it plans to deploy the ultra-thin packaging technology across its Kinetis MCU portfolio. The company expects the new packaging to drive new product innovations.
“In the IoT era, an incessant demand for ’what’s next’ is challenging systems designers to consistently deliver breakthrough solutions,” said Steve Tateosian, manager of microcontroller platforms for Freescale, in a statement. “Freescale’s new Kinetis package – measuring as thin as a blade of grass – demonstrates our commitment to advancing the consumer electronics, IoT and secure payments markets by enabling manufacturers to focus on their most taxing design challenges, while pushing the boundaries of functionality and integration.”
Freescale also offers the smallest single chip module (SCM) for the IoT, replacing a six-inch board with a device the size of the U.S. dime. The company said the SCM reduces the need for 100-plus components down to one. Another small MCU is the Kinetis KL03 MCU – touted as the industry’s smallest and most energy efficient ARM-based 32-bit MCU – which fits into the dimple of a golf ball.
Availability: Available with the orderable part number: MK22FN512CBP12R.
Pricing: Click here for ordering information.
