Newark element14 is today launching the LPC43S67 & A70CM Cloud Connectivity Kit for the design engineer to successfully build secure IoT applications with AES encryption, NFC, WiFi, and a host of sensing technologies, driven by powerful, multi-core ARM processing capabilities.
The LPC43S67 & A70CM Cloud Connectivity Kit offers a high-performance, dual-core ARM Cortex processor along with IC-enabled security and add-on boards affording the designer a range of IoT features like NFC, AES128/192/256 encryption, WiFi connectivity, Ethernet, accelerometer, gyroscope, temperature sensor, and an LCD, making it a great platform for anyone experimenting with IoT or cloud-backed mobile applications.
Beyond the target hardware, which includes the LPCXpresso43S67 board with LPC43S67 dual-core (M4F and M0+) MCU and NXP A7001CM Secure Element, NTAG NDC plug-in card, LPC General Purpose Shield (hosting an accelerometer, gyroscope, temperature sensor, joystick and LCD), IEEE 802.11b/g SD card, this kit is supported by NXP’s LPCXpresso IDE and ZentriOS – a complete connected product operating system available as a licensable software solution. The Zentri SDK, can be easily combined with the rich editing and debugging capabilities of the LPCXpresso IDE by installation of a free plugin.
Debugging is simplified by LPCXpresso43S67’s on-board Link2 probe, which provides full source code debugging capability without the need for any additional hardware.
The LPCXpresso Development Boards offer a high-performance, dual-core ARM Cortex processor Cortex-M4F and Cortex-M0+ running at up to 204MHz, along with IC-enabled security for development and prototyping of secure mobile or cloud-connected applications LPC43Sxx devices only. The board is expandable by way of Arduino Uno R3 and Pmod-compatible headers. Debug is enabled via on-board, high-speed USB debug probe.
The LPCXpresso family of boards provides a powerful and flexible development system for NXP’s Cortex-M MCUs. The LPCXpresso boards have been developed by NXP to enable evaluation of and prototyping with the LPC4300 series of MCUs, and features the LPC43S67 and LPC43S67 in their 100 PIN BGA package option.
With LPCOpen Software Packages, users can quickly and easily utilize NXP’s extensive array of microcontroller software libraries to create and develop multifunctional products.
The NXP LPC43S67 & A70CM Cloud Connectivity Kit, NXP LPCXpresso43S67 and LPCXpresso4367 Development Boards are available from Newark element14 in North America, Farnell element14 in Europe and element14 in APAC.