Riverside, Calif.– Bourns, Inc., a leading manufacturer and supplier of electronic components, today announced that it has acquired specified assets of the trimming potentiometer business of Murata Manufacturing Co., Ltd. The transfer of the acquired assets will begin in early 2016. Financial terms of the transaction were not disclosed. Bourns invented the world’s first trimming…
Phoenix, Ariz. – Avnet, Inc. (NYSE: AVT), a leading global technology distributor, has announced that Eric Williams has been named to the newly created role of vice president, Internet of Things (IoT) for Avnet worldwide. In this role Williams will develop and deploy a global IoT strategy, working across the company to design, develop and drive…
The numbers are in for global PC shipments in 2015, and they are in line with industry expectations. IDC reports that global PC shipments totaled 71.9 million units in the fourth quarter of 2015 (4Q15), translating into a year-on-year decline of 10.6 percent. Gartner’s numbers are a bit more optimistic, reporting global PC shipments of…
Chandler, Ariz. — Microchip Technology Incorporated (NASDAQ: MCHP), a leading provider of microcontroller, mixed-signal, analog and Flash-IP solutions today announced that it was informed last night that the Board of Directors of Atmel Corporation (NASDAQ: ATML) had determined that Microchip’s proposal to acquire Atmel for $8.15 per share in a cash and stock transaction constitutes a “Superior Proposal”…
The US manufacturing index is at its lowest level since 2009. This is sobering news for the industry and for the economy. Within the industry, it is clear that the road ahead is not flat, straight, or even smooth. For companies to not just survive, but to also succeed, action needs to be taken. In…
Arrow Electronics (NYSE: ARW) and Cadence Design Systems, Inc. (NASDAQ: CDNS) today announced a collaboration that will bring integrated design tools to engineers, helping them accelerate the pace of new product development and get products to market faster and cheaper. As part of the collaboration, the companies plan to allow engineers using the Cadence® OrCAD®…
Lyon, France – New advanced packaging technologies are expected to result in big changes in the semiconductor industry, driven in part by the Internet of Things (IoT), according to a new report from Yole Développement. The focus is expected to center on integration and wafer level packages (WLP) to deliver greater functionality, improved cost, and…
The Board of Directors of Peerless Electronics Inc. is pleased to announce that William (Bill) Gallucci will assume the role of president, effective January 1, 2016. Most recently, Mr. Gallucci served as Chief Operating Officer responsible for the operations of the company. As president, Mr. Gallucci’s responsibilities will expand to include overseeing the company’s day-to-day…
According to a new market report published by Transparency Market Research “Supercapacitor Market – Global Industry Analysis, Trend, Size, Share and Forecast 2015 – 2023”, the global supercapacitor market was valued at US$1.21 bn in 2014 and is expected to reach US$7.37 bn by 2023, at a CAGR of 22.3% from 2015 to 2023. Go green revolution adopted across the globe is one…
Qualcomm Incorporated (NASDAQ: QCOM) and TDK Corporation (TSE: 6762) today announced an agreement to form a joint venture to enable delivery of RF front-end (RFFE) modules and RF filters into fully integrated systems for mobile devices and fast-growing business segments, such as Internet of Things (IoT), drones, robotics, automotive applications and more, under the name…