Thanks in large part to LTE, the global RF power semiconductor market is expected to grow from $10.57 billion in 2015 to $31.26 billion by 2022, according to MarketsandMarkets. RF power semiconductor devices are used in application areas such as aerospace, automotive, military, medical, energy, consumer, telecommunications and data communications.
The use of power amplifiers for long-term evolution (LTE) has increased with the growing demand for LTE. The transition to LTE would require a significant investment in the market as the core networks would also need to change for the upgradation of the wireless standard. This would also drive the demand for RF power devices, which would boost the growth of the RF power semiconductor market.
RF power amplifiers are expected to hold the largest market share and dominate the RF power semiconductor market between 2016 and 2022 owing to the increasing adoption of power amplifiers across the globe. The growing preference for wireless connectivity has driven the use of RF power devices in wireless connectivity.
Consumer applications are expected to hold the largest market share and dominate the RF power semiconductor market between 2016 and 2022. The increased use of smartphones will help drive the overall RF power semiconductor market at a CAGR of 15.4 percent between 2016 and 2022.
Geographically, the Asia-Pacific region is expected to hold the largest market share and dominate the RF power semiconductor market between 2016 and 2022. The established electronics industry and adoption of innovative technologies are the reasons for the high growth rate in the region. The RF power semiconductor market in Asia-Pacific is expected to grow at a high rate in consumer, telecommunication and data communication, and medical sectors among others. The increasing number of players in the region is further expected to drive the growth of the APAC RF power semiconductor market.
The key players in RF power semiconductor market include Infineon Technologies AG (Germany), M/A-COM Technology Solutions Holdings, Inc. (U.S.), NXP Semiconductors N.V. (Netherlands), Qorvo, Inc. (U.S.), Broadcom Limited (U.S.), Toshiba Corporation (Japan), Qualcomm Inc. (U.S.), Skyworks Solutions, Inc. (U.S.), Mitsubishi Electric Corporation (Japan), and Murata Manufacturing (Japan).