TTI Appoints New SVP of Finance

TTI, Inc, the leading authorized distributor of interconnect, passive, electromechanical and discrete components, today announced the  appointment of Chris Goodman to the position of Senior Vice President Finance and Chief Financial Officer. In making the announcement, Paul Andrews, CEO, offered, “Chris is an accomplished, senior financial executive with Big 4 background and 20 years experience…

Future, Zytronic Sign Global Distribution Agreement

Zytronic, a leader in custom designed, durable, high performance Projected Capacitive Technology (PCT™ and MPCT™) touch sensors today announced that it has signed a worldwide distribution agreement with Future Electronics, a global leading distributor of electronic components. The formal agreement extends a successful partnership between the two companies, who have already worked together to create…

Mouser First to Offer TI LDC2114 Evaluation Module

Mouser Electronics, Inc., the industry’s leading New Product Introduction (NPI) distributor with the widest selection of semiconductors and electronic components, is first to offer the LDC2114 Evaluation Module (EVM) for the LDC2112 and LDC2114 inductive touch solutions from Texas Instruments (TI). A new addition to TI’s sensing solutions, the LDC2114EVM demonstrates the use of inductive…

RS Components Joins ECIA

ECIA is pleased to welcome RS Components (RS) to its growing family of electronic component manufacturers, their manufacturer representatives and authorized distributors. RS Components and its sister North American based company, Allied Electronics, are the trading brands of Electrocomponents plc, a global, engineering focused distributor. “RS Components, with its strong presence in EMEA, helps ECIA in our strategy to expand…

Balanced Armature Drivers Offer Premium Sound for Earphones

Knowles Corporation launched the new RAF Series of balanced armature drivers for the next generation of premium headsets. Developed for wireless products, the receiver’s small dimensions and high efficiency make it well suited for a variety of applications including premium music earphones, hearables, Bluetooth headsets, communications earpieces, and miniature sound amplifiers. The RAF Series occupies less volume than…

Wireless Power Modules Replace Medical & Industrial Connectors

NuCurrent, a manufacturer of thin, high quality (Q) factor, printed wireless power transfer solutions, introduced a new family of wireless power connector alternatives at the Consumer Electronics Show (CES) 2017. The ultra-small power and sense modules were developed for engineers looking to reduce connector field failures in high-use, harsh environments and for new designs which were…

Voice Activation Development Kit Targets Battery-Powered Devices

Vesper, a developer of advanced acoustic sensors, DSP Group, Inc., a global provider of wireless chipset solutions for converged communications, and Sensory, Inc., a developer of voice interface and keyword-detect algorithms, will demonstrate their voice activation development kit for battery-powered devices at CES 2017. The turnkey development platform claims the lowest overall power consumption for far-field,…

Biometric Sensor Delivers High Accuracy for Wearables, Hearables

Valencell launched two new versions of its Benchmark biometric sensor systems. These are highly accurate biometric sensor modules that incorporate the company’s PerformTek biometric technology. The two new designs include Benchmark BE2.0, a version designed specifically for hearables, and Benchmark BW2.0, a 2-LED version of its original Benchmark sensor system for wearables worn at the wrist and arm.…

Bluetooth Audio SoC Adds Active Noise Cancelling

Qualcomm Inc. announced that its subsidiary, Qualcomm Technologies, International, Ltd., has added active noise cancelling (ANC) to its CSR8675 product platform, claiming the industry’s first Bluetooth audio system-on-chip (SoC) to integrate this advanced technology. The new feature reduces the complexity and cost of adding active noise cancelling to headphones by eliminating the need for a separate ANC…

Multi-Protocol SoC Delivers Smarter Homes

Greensboro, N.C. – Qorvo, a provider of RF solutions, introduced a complete system on chip (SoC) for smart home devices that delivers multi-protocol support with “best-in-class” power consumption. The GP695 SoC integrates multiple communication protocols, including IEEE 802.15.4, ZigBee 3.0, Thread and Bluetooth Low Energy (BLE) for sensors and actuators throughout the home. This enables a…