Molex announced today it has teamed up with BlackBerry Limited (NYSE: BB; TSX: BB) on the development of a 10 Gbps Ethernet Automotive Networking platform designed to increase data bandwidth in intelligent connected vehicles. Integrating very reliable high-speed data transmission, prioritization, scalability, and BlackBerry’s advanced embedded security solutions, the new Molex network platform will be officially unveiled at…
Alliance Memory today announced that it has expanded the industry’s widest offering of high-speed CMOS DDR3 and low-voltage DDR3L SDRAMs with new 512Mb x8 and x16 devices in the 78-ball and 96-ball FBGA packages, respectively. Featuring a DDR architecture, the SDRAMs provide extremely fast transfer rates of 1600Mbps and clock rates of 800MHz. “Very few…
Xilinx, Inc. (NASDAQ: XLNX) today announced that its board of directors has appointed Victor Peng as president and chief executive officer, effective January 29, 2018. Peng will become the fourth CEO in Xilinx’s history and takes the helm of the global market leader of programmable semiconductor products at a time of increasing momentum and opportunity. “Victor is unique in…
A December meeting between China’s National Development and Reform Commission (NDRC) and Samsung Electronics about the company’s role in price increases for memory products could moderate DRAM price hikes in the first quarter of 2018, according to DRAMeXchange a division of TrendForce. It also could potentially drive Samsung, the market leader for DRAM and NAND flash, to…
The average selling price (ASP) for analog ICs has dropped 2.25 percent since December 2016 and is projected to fall by one percent in 2018, according to a market update from Semico Research Group. The ASP for analog ICs was $0.344 in 2017. While many electronics component segments, including memory devices and passive components, have…