CMOS Image Sensors Deliver High Growth

The CMOS image sensor market is on track to grow 15 percent in 2015, reaching $10.1 billion, after a strong increase of 19 percent in 2014, according to IC Insights. This is after only four percent growth in 2013 due to price erosion and inventory corrections in the camera phone market, said the market researcher.…

A Peek Inside a Buyer’s Toolkit

Buyers have a host of tools at their disposal to help them do their jobs better and faster. These electronics components inventory search and/or data aggregator websites have one thing in common – delivering parts data that range from supply chain information including lead times, pricing, lifecycle/obsolescence information, and environmental compliance data;  to technical specifications…

Samsung Delivers V-NAND SSDs

Seoul, Korea – Samsung Electronics Co., Ltd. added three TCO-optimized, high-performance SSDs, based on 3-dimensional (3D) Vertical NAND (V-NAND) technology, to its portfolio of advanced enterprise and data center SSDs. Designed for OEMs, the PM1633, PM1725 and PM953 SSDs are available in a range of interfaces and form factors based on Samsung’s proprietary 3-bit MLC V-NAND flash…

Amphenol Rolls High-Current Cabling System

Sidney, N.Y. – Amphenol Industrial Products Group releases SurLok Plus, a high current cabling system designed for energy storage in commercial and residential battery storage systems as well as electric and hybrid electric vehicles. SurLok Plus, used by inverter and power supply manufacturers, is optimized for battery pack connections from 50 A to 400 A using a touch-safe…

Toshiba Unveils BiCS FLASH Memory

Irvine, Calif. — Toshiba America Electronic Components, Inc. (TAEC), has developed the new generation of BiCS FLASH, a three-dimensional (3D) stacked cell structure flash memory.  Touted as the industry’s first 256-gigabit (32 gigabyte) 48-layer BiCS FLASH device, it also uses 3-bit-per-cell TLC (triple-level cell) technology. Toshiba defines the stacked cell structure as “a structure stacking Flash memory cells…

Toshiba Develops Stacked NAND Flash with TSV

Tokyo, Japan – Toshiba Corporation claims the development of the industry’s first 16-die (max.) stacked NAND flash memory using Through Silicon Via (TSV) technology. The prototype uses TSV technology that uses the vertical electrodes and vias to pass through the silicon dies for the connection. “This enables high speed data input and output, and reduces power consumption,” said…

Crystek Offers Ultra-Low Phase Noise Oscillator

Fort Myers, Fla. – Crystek Corporation launched the CCPD-575, an ultra-low phase noise LVPECL Oscillator that provides a -162 dBc/Hz noise floor. The clock oscillator claims an industry leading phase noise for an LVPECL oscillator – at least 15 dB lower phase noise than most LVPECL oscillators on the market today. Other key specs include close-in phase noise @ -90…