Semiconductor Equipment Spending Fell 12%

Global semiconductor capital equipment spending fell 11.5 percent in 2013 to $33.8 billion, according to Gartner, Inc. While wafer-level manufacturing equipment demand performed better than market average, driven by lithography and associated processes, back-end manufacturing segments performed below average, significantly contributing to revenue declines, according to the report. Wafer-level manufacturing outperformed the market in 2013, based on…

TI Extends Small Packaging to MSP430 MCUs

Dallas, Tex. — Texas Instruments (TI) has expanded the availability of tiny package sizes to several new families of ultra-low-power MSP430 microcontrollers (MCUs). This enables the design of smaller products with TI’s ultra-low-power FRAM-based MSP430FR5738 and Flash-based MSP430F51x2 MCUs in wafer-level chip scale packages (WLCSP) as small as 2.0 x 2.2 x 0.3 mm, in…

Econais Claims Smallest, Smartest Wi-Fi Module

San Jose, Calif. — Econais Inc. claims the industry’s smallest, smartest and most integrated Wi-Fi (SiP) module for smart home, M2M, and Internet of Things (IoT) device designs. The WiSmart EC19W01 802.11b/g/n Wi-Fi system-in-package (SiP) module is housed in a 14- x 16- x 2.8-mm footprint that fully integrates the microcontroller, Wi-Fi, cloud connectivity, Flash,…

Altera Offers High-Efficiency Power Conversion for FPGAs

San Jose, Calif. — Altera Corp. offers a new power conversion solution that makes it easy for board developers to design point-of-load power solutions, while achieving the highest FPGA performance at the lowest system power, according to the company. The power conversion solution is a monolithic 40A driver plus synchronous MOSFET powertrain that is optimized…