450mm: It’s Different This Time

The move to 450mm semiconductor wafer size will inevitably be an inflection point for the industry, with enormous ramifications for the complete semiconductor ecosystem. Those firms with 450mm capability will enjoy a huge competitive advantage of staying on the More Moore node development roadmap, a potential 30 percent lower die cost advantage, and a more…

Big Plans for Russia’s Silicon Valley

Many people already know about the Skolkovo Innovation Center, the Russian project that plans to focus development on key sectors of modern technology, as well as provide a special economic environment for major companies. Among the priorities of the so-called “Innograd” (Innovation Town) are: space, telecommunications, medical equipment and pharmaceuticals, energy, information technology, and nuclear…

Chip Spotlight: Monolithic 3D ICs

3D chips based on through-silicon vias (TSVs) have been in the works for several years, but apart from a few special applications they have so far failed to move into the mainstream. While TSV-based 3D has moved into the engineering stage, mass production remains a moving target, with early adopters favoring a so-called 2.5D technique…