Balanced Armature Drivers Offer Premium Sound for Earphones

Knowles Corporation launched the new RAF Series of balanced armature drivers for the next generation of premium headsets. Developed for wireless products, the receiver’s small dimensions and high efficiency make it well suited for a variety of applications including premium music earphones, hearables, Bluetooth headsets, communications earpieces, and miniature sound amplifiers. The RAF Series occupies less volume than…

Wireless Power Modules Replace Medical & Industrial Connectors

NuCurrent, a manufacturer of thin, high quality (Q) factor, printed wireless power transfer solutions, introduced a new family of wireless power connector alternatives at the Consumer Electronics Show (CES) 2017. The ultra-small power and sense modules were developed for engineers looking to reduce connector field failures in high-use, harsh environments and for new designs which were…

Voice Activation Development Kit Targets Battery-Powered Devices

Vesper, a developer of advanced acoustic sensors, DSP Group, Inc., a global provider of wireless chipset solutions for converged communications, and Sensory, Inc., a developer of voice interface and keyword-detect algorithms, will demonstrate their voice activation development kit for battery-powered devices at CES 2017. The turnkey development platform claims the lowest overall power consumption for far-field,…

Bluetooth Audio SoC Adds Active Noise Cancelling

Qualcomm Inc. announced that its subsidiary, Qualcomm Technologies, International, Ltd., has added active noise cancelling (ANC) to its CSR8675 product platform, claiming the industry’s first Bluetooth audio system-on-chip (SoC) to integrate this advanced technology. The new feature reduces the complexity and cost of adding active noise cancelling to headphones by eliminating the need for a separate ANC…

Multi-Protocol SoC Delivers Smarter Homes

Greensboro, N.C. – Qorvo, a provider of RF solutions, introduced a complete system on chip (SoC) for smart home devices that delivers multi-protocol support with “best-in-class” power consumption. The GP695 SoC integrates multiple communication protocols, including IEEE 802.15.4, ZigBee 3.0, Thread and Bluetooth Low Energy (BLE) for sensors and actuators throughout the home. This enables a…

MediaTek Chipset Enables Crystal-Clear Audio

MediaTek announced the availability of the MT2533D, a highly integrated chipset for smart, connected headphones, headsets, earpieces and hands-free systems, at the 2017 Consumer Electronics Show (CES). Although designed for wireless headphones and in-vehicle hands-free systems, the MT2533D chipset also can be used in stand-alone sports headsets or travel earpieces thanks to local MP3 playback,…

Cypress Demos Direct USB-C to HDMI Cable

San Jose, Calif. – Cypress Semiconductor Corp. claims the industry’s first complete solution for USB-C to native HDMI connections without adapters or converters. Based on Cypress EZ-PD USB-C controllers, the solution allows next-generation laptops, smartphones, tablets, digital cameras and other HDMI-enabled sources with USB-C connectors to connect directly to HDMI-enabled displays, including HD and 4K televisions,…

Flip Chips and Solder Bump Technology Gaining Popularity

In modern times, the flip chip market has seen a lot of new advancements and innovations. Flip chips are used in a wide array of industries such as electronics, automotive & transport, IT & telecommunication, and healthcare. The electronic industry has witnessed a surge in the demand for flip chips as smartphones and tablets are…

STMicroelectronics Launches New Microcontrolers

STMicroelectronics (STM), a global semiconductor leader serving customers across the spectrum of electronics applications, has launched a new family of automotive microcontrollers that heralds the advent of more secure and connected cars. This new family of power-efficient and real-time-capable MCUs brings the world`s first Power Architecture(TM)- based devices manufactured in state-of the-art 40nm Flash technology…

TI introduces the first differential inductive switch

Texas Instruments (TI) (TXN) today introduced the industry’s first differential inductive switch, with a dual-coil architecture that automatically compensates for variations in temperature and component aging. The LDC0851 detects the presence or absence of conductive material by using a simple coil drawn on a printed circuit board (PCB). This unique approach enables low-cost, highly reliable…