Samsung Delivers V-NAND SSDs

Seoul, Korea – Samsung Electronics Co., Ltd. added three TCO-optimized, high-performance SSDs, based on 3-dimensional (3D) Vertical NAND (V-NAND) technology, to its portfolio of advanced enterprise and data center SSDs. Designed for OEMs, the PM1633, PM1725 and PM953 SSDs are available in a range of interfaces and form factors based on Samsung’s proprietary 3-bit MLC V-NAND flash…

Toshiba Unveils BiCS FLASH Memory

Irvine, Calif. — Toshiba America Electronic Components, Inc. (TAEC), has developed the new generation of BiCS FLASH, a three-dimensional (3D) stacked cell structure flash memory.  Touted as the industry’s first 256-gigabit (32 gigabyte) 48-layer BiCS FLASH device, it also uses 3-bit-per-cell TLC (triple-level cell) technology. Toshiba defines the stacked cell structure as “a structure stacking Flash memory cells…

Toshiba Develops Stacked NAND Flash with TSV

Tokyo, Japan – Toshiba Corporation claims the development of the industry’s first 16-die (max.) stacked NAND flash memory using Through Silicon Via (TSV) technology. The prototype uses TSV technology that uses the vertical electrodes and vias to pass through the silicon dies for the connection. “This enables high speed data input and output, and reduces power consumption,” said…

ROHM AC/DC Converter Control Targets SiC MOSFET Drive

Santa Clara, Calif. —  ROHM touts the development of the industry’s first AC/DC converter control IC designed specifically for SiC MOSFET drive in industrial equipment such as servers and other large power applications. The BD7682FJ-LB integrates a gate drive circuit optimized for SiC MOSFET drive, together with a quasi-resonant system that delivers lower noise and higher efficiency versus…

Microsemi Debuts Inductive Sensor Interface ICs

Aliso Viejo, Calif.  — Microsemi Corp. rolled out the first device in its new family of sensor interface integrated circuits (ICs) based on inductive sensing technology. The company claims the LX3301A as the first inductive sensor IC in the market using linear variable differential transformer (LVDT) architecture implementations on printed circuit boards (PCB), targeting automotive and…

ST Claims First Auto-Qualified 2-Mbit EEPROM

STMicroelectronics claimed the industry’s first AEC-Q100-qualified 2Mbit EEPROM device opening up new opportunities in parameter storage and management in complex automotive modules. These include new advanced applications such as hybrid, electric, or high-power truck engines that require extensive use of various parameters, including the information on air volume, fuel injection, exhaust, or battery charge, to maximize power-conversion…

GreenPeak Chipset Supports Multi-Protocols

Utrecht, The Netherlands – GreenPeak Technologies recently launched a multi-protocol chipset that supports both ZigBee and Thread networks. Not only does it help to future-proof IoT solutions, it also significantly reduces costs when designing set-top boxes and gateways. The company touts the new GP712 as the industry’s first single radio multi-protocol chipset with multi-channel receive capability…

AOS Expands IGBT Series

Sunnyvale, Calif. — Alpha and Omega Semiconductor Limited (AOS) expanded its IGBT product portfolio with the launch of the 650V M-Series. The new M-series is co-packaged with a soft and fast freewheeling diode available in a variety of package types. Applications include motor drives in refrigerators, washing machines, fans, air conditioners, treadmills, and sewing machines applications.…