GM Awards Bourns China Facility

Riverside, Calif. – Bourns, Inc., a leading manufacturer and supplier of electronic components, today announced the company’s China, Xiamen facility has received the 2013-2014 Supplier Quality Excellence Award from General Motors (GM) China.  GM’s Supplier Quality Excellence Award recognizes key suppliers that have achieved outstanding performance on multiple levels of key performance indicators (KPIs) over the preceding 12 month period.  Bourns Xiamen Automotive Division supplies steering…

TTI Adds Syfer to Line Card

Fort Worth, Tex. − TTI, Inc., the leading authorized distributor of interconnect, passive, electromechanical and discrete components, today announced the company has signed a distribution agreement with Syfer, a global leader in EMI filters, EMC solutions and capacitor products. A division of Erie Electronics in the 1960s, Syfer was later acquired by Dover Corporation and…

RS Components Stocks ADI Blackfin DSPs

Beijing — RS Components (RS), the trading brand of Electrocomponents plc (LSE: ECM), the global distributor for engineers, is stocking the first DSPs in Analog Devices’ new power-efficient high-performance ADSP-BF70x Blackfin® family. The ADSP-BF70x Blackfin family is based on Analog’s new Blackfin+ core, which supports 16-bit and 32-bit fixed-point processing and offers many efficiency improvements.…

SMIC Shenzhen Fab Begins Operation

Shanghai — Semiconductor Manufacturing International Corporation (“SMIC”; NYSE: SMI; SEHK: 981), the largest and most advanced pure-play foundry provider in China, announced today it has begun operations at its Shenzhen 200mm wafer fab. This fab is the first 8-inch production line to be put into operation in Southern China, and is also the first domestic IC production line…

Newark element14 Launches NFC Expansion Board

Chicago, Ill. – Newark element14 announces the global launch of a high-performance full NFC expansion board, EXPLORE-NFC, allowing users of Raspberry Pi to experiment and simply add NFC functionality to their designs. The new product supports all three NFC modes: Reader mode, Peer-to-Peer modes and Card Emulation standards. Based on the PN512 NFC solution from NXP Semiconductors, the…

Bourns Awards Top European Distributor Partners

Riverside, Calif.- Bourns, Inc., a leading manufacturer and supplier of electronic components, today announced that it acknowledged the company’s top performing distributors with its European Distributor Awards during an event at this year’s Electronica trade show held in Munich, Germany. Bourns developed the awards to recognize the outstanding contributions by its distributor channel partners over the past…

Yole: Silex Commits to Thin Film PZT Technology

Lyon, France – Last year, Yole Développement identified a growing interested for thin film PZT, especially for MEMS applications. Indeed, MEMS thin film PZT applications reached a combined market of $350M in 2013. Under this context, the company released a dedicated report, Thin Film PZT for Semiconductor Application Trends & Technology Update (Dec. 2013 – report description). Since this…