Molex Contributes to Automotive Ethernet

Lisle, Ill. – Molex Incorporated announces its Mini50™ line of connection systems has been instrumental in setting the performance guidelines being established for Single Twisted Pair Ethernet (IEEE P802.3bw 100BASE-T1), slated to be launched in 2015 by automotive OEMs.  Automotive Ethernet will be one of the topics discussed at CES 2015, to be held Jan. 6-9 in Las Vegas, where…

RFMW Adds New Components Director

RFMW, Ltd. announces that Gerry Camacho has joined their organization as worldwide Director of Coaxial Components. Mr. Camacho has served in senior management positions within RF distribution and engineering positions at well-known industry OEMs. His accomplishments include VP of Technical Marketing at Pasternack Enterprises, Regional Sales Management, Antenna and Test Engineering at Lockheed and TRW.…

MegaChips, Bosch SensorTec Partner on Fitness Tracking

CES, Las Vegas – MegaChips Corporation today announced a partnership with Bosch Sensortec to provide a complete reference design for use in smartphones, wearables and other personal devices allowing consumers to monitor their activities in real time. Available today, the reference design provides both context and location awareness for health, fitness and indoor navigation monitoring…

Greenvity, Mitsumi Deliver Smart Outdoor Lights

Milpitas, Calif. – Greenvity Communications and Mitsumi Electric have expanded their collaborative relationship to include development and manufacturing of a complete Internet of Things (IoT) turnkey solution with cloud and mobile apps for low voltage LED lights in outdoor applications. LED lighting OEMs and ODMs can transform conventional low-voltage outdoor lights into energy-efficient smart lights with controllability for turning on/off,…

MEMSensing Touts Smallest 3-Axis Accelerometer

Shanghai — MEMSensing Microsystems Co., Ltd. (“MEMSensing”), a pioneer in MEMS sensor design and products development in China, and Semiconductor Manufacturing International Corporation (“SMIC”, NYSE: SMI; SEHK: 981) jointly announced the launch of the world’s smallest 3-axis accelerometer MSA330, which utilizes SMIC’s CMOS integrated MEMS device fabrication and TSV-based wafer level packaging technologies. By vertically integrating…