Cree Earns U.S. DoD MRL 8 Designation

Durham, N.C. — Cree, Inc. (Nasdaq: CREE), a leader in gallium nitride (GaN) RF devices, has earned the U.S. Department of Defense (DoD) manufacturing readiness level eight (MRL 8) designation. Awarded for its production of GaN monolithic microwave integrated circuits (MMICs), this designation verifies Cree’s ability to provide assured, affordable and commercially viable production capabilities…

TTI Adds FCT Electronics to Linecard

TTI, Inc., the leading global distributor of interconnect, passive, electromechanical and discrete components, announced today the company has added FCT Electronics Group as a new connector supplier. FCT Electronics Group specializes in designing and manufacturing custom mixed-layout connectors and cable assemblies. The company was acquired in 2013 by Molex Incorporated, a leading supplier of connectors…

Element14 Names Design Winners

Element14 has selected the winning designs in its Inductive Sensing Design Challenge, featuring the world’s first inductance-to-digital converter from Texas Instruments. Belgian designer Sammy Peiren was named the Grand Prize Winner for his USB microphone concept, and Dutch designer Elbert Kreukniet was named Community Choice Winner for his wireless metal detector. The two designs stood…

Raytheon Awards Pasternack

Pasternack Enterprises, Inc., an industry-leading manufacturer and supplier of RF, microwave and millimeter wave products, has been awarded the 4-Star Supplier Excellence Award by Raytheon’s Integrated Defense Systems (IDS) business. This is the second consecutive year that Pasternack has been honored with a Supplier Excellence Award from Raytheon IDS. Raytheon’s Integrated Defense Systems business instituted…

ARM, Cadence Expand IoT Collaboration

Cambridge, England — ARM® and Cadence today announced an expanded collaboration for IoT and wearable devices targeting TSMC’s ultra-low power technology platform. The collaboration enables the rapid development of IoT and wearable devices by optimizing the system integration of ARM IP and Cadence’s integrated flow for mixed-signal design and verification, and their leading low-power design and verification…

TSMC Launches Ultra-Low-Power Platform for IoT

Hsinchu, Taiwan, R.O.C. — TSMC (TWSE: 2330, NYSE: TSM) today announced the foundry segment’s first and most comprehensive ultra-low power technology platform aimed at a wide range of applications for the rapidly evolving Internet of Things (IoT) and wearable device markets that require a wide spectrum of technologies to best serve these diverse applications. In this platform,…

Microsemi Unveils Advanced SmartFusion2 Dev Kit

Aliso Viejo, Calif. — Microsemi Corporation (Nasdaq: MSCC), a leading provider of semiconductor solutions differentiated by power, security, reliability and performance, today announced the availability of the company’s new largest density, lowest power SmartFusion®2 150K LE System-on-Chip (SoC) FPGA Advanced Development Kit. Board-level designers and system architects can quickly develop system-level designs by using the two…