IPC: PCB Shipments Reflect Seasonal Slowdown

Bannockburn, Ill. — IPC — Association Connecting Electronics Industries® announced today the July findings from its monthly North American Printed Circuit Board (PCB) Statistical Program. Sales and orders were weaker in July, but the book-to-bill ratio held steady at parity. Slump in Sales and Orders is Typical for July Total North American PCB shipments decreased 2.3 percent in…

ROHM Establishes Foundry Business for New MEMS Process

Santa Clara, Calif.– ROHM has recently established a process for MEMS (Micro Electro Mechanical System) utilizing thin-film piezoelectric elements, and implemented the industry’s first* foundry business that integrates product design and manufacturing processes, from wafer pulling to mounting, in order to meet a variety of customer needs. Piezoelectric elements, which possess the inherent property of generating a…

Trimble, Digi-Key Ink Global Distribution Deal

Sunnyvale, Calif.– Trimble (NASDAQ: TRMB) announced today a global distribution agreement with Digi-Key Corporation, the industry leader in electronic component selection, availability and delivery, to offer Trimble’s ThingMagic® Mercury® 6e Series and Mercury 5e Series of embedded UHF RFID modules. The ThingMagic family of award winning embedded RFID modules is used worldwide to reduce development costs and speed the time-to-market for…

Broadcom Offers New WICED Dev Kit for IoT

Irvine, Calif. — News Highlights: Enables software and hardware developers to prototype and experiment with new Internet of Things (IoT)  applications Includes latest WICED™ Bluetooth® Smart chip and five low-power MEMS sensors Development kit and smartphone app can be connected and running programs in minutes Broadcom Corporation (NASDAQ: BRCM), a global innovation leader in semiconductor…

Analog Devices’ Q3 Sales Increase

Analog Devices, Inc. (NASDAQ: ADI), a global leader in high-performance semiconductors for signal processing applications, today announced financial results for its third quarter of fiscal year 2014, which ended August 2, 2014. “ADI had another good quarter of revenue growth led by the industrial and communications infrastructure markets,” said Vincent Roche, President and CEO. “Profitability and…

Samsung Mass Produces First 3D TSV DDR4 Modules

Seoul, Korea – Samsung Electronics, Ltd. announced today that it has started mass producing the industry’s first 64 gigabyte (GB), double data rate-4 (DDR4), registered dual Inline memory modules (RDIMMs) that use three dimensional (3D) “through silicon via” (TSV) package technology. The new high-density, high-performance module will play a key role in supporting the continued proliferation of enterprise…

Binder-USA, Northwire Form Strategic Partnership

Camarillo, Calif. — ­ Binder­-USA, a global supplier of high ­quality circular connectors and cordsets for over 50 years, has formed a strategic partnership with Northwire, Inc., which produces custom wire and cable interconnect solutions. The strategic partnership between Binder­-USA and Northwire, Inc. will enhance the potential for both companies to better service their key…

DRAM Prices Will Continue to Fall

Despite higher DRAM prices starting in the second quarter of 2014 due in part to a lack of capacity expansions and increased obstacles in transitioning to 2Xnm manufacturing, DRAM prices start to drop at the end of July, according to DRAMeXchange, the memory and storage research division of TrendForce. Prices are expected to continue downward…