SiliconExpert Updates Electronic Component Database

Santa Clara, Calif.– SiliconExpert Technologies, the leading provider of electronic component management tools and solutions announces its largest data release yet, increasing the number of electronic components it carries, the number of engineers behind the data and total manufacturers captured in its Electronic Component Database. With this latest data release, SiliconExpert Technologies increased the number of…

Murata Launches New Global Site

Murata today announced the launch of their new global web site at murata.com. Using the recently released new corporate visual identity, the site has a fresh modern and tablet-friendly design. Aimed to increase customer satisfaction and ease navigation and access to relevant technical application content, the site now incorporates the complete line-up of Murata products and more application related content. Hiroshi Iwatsubo, Senior Vice President,…

FCI & Samtec Sign Connector Sourcing Pact

FCI Electronics and Samtec Inc., two leading suppliers of high speed connectors and interconnect systems, today announced the signing of a second-source agreement under which Samtec is licensed to manufacture, market and sell FCI’s next generation ExaMAX® high speed connector product portfolio. Officials from both companies expressed their excitement in this new partnership. “This second-source…

Kemet & NEC Amend Option Agreement

KEMET Corporation (NYSE: KEM) (“KEMET”), a leading global supplier of electronic components, today announced that its wholly-owned subsidiary, KEMET Electronics Corporation (“KEC”), and NEC Corporation (“NEC”) have entered into an amendment to the parties’ March 12, 2012 Option Agreement. “This Amendment provides KEMET with additional flexibility in managing our capital structure,” stated Per Loof, Chief…

Broadcom Combo Chip Doubles Wi-Fi Performance

Irvine, Calif., — Broadcom Corporation (NASDAQ: BRCM), a global innovation leader in semiconductor solutions for wired and wireless communications, today announced the industry’s most powerful 5G WiFi (802.11ac) 2×2 Multiple Input Multiple Output (MIMO) combo chip for mobile devices. The BCM4358 delivers unparalleled throughput, Bluetooth co-existence performance and indoor location accuracy, enabling OEMs to design high-end…

China Capacitor Market to Reach $5.6 Billion in 2014

On the basis of dielectric material used, capacitors are categorized into ceramic, film, electrolytic, solid double layer, carbon, dielectric, and paper & plastic capacitors. Electrolytic capacitors are further classified into aluminum and tantalum electrolytic capacitors. Electronic capacitors are used in various end user applications such as Information & Communication Technology (ICT), consumer electronics, industrial, infrastructure,…

Avnet Releases PicoZed System-On-Module

Phoenix, Ariz. —Avnet Electronics Marketing, an operating group of Avnet, Inc. (NYSE: AVT) today released PicoZed™, its newest family of System-On-Modules (SOMs) based on the Xilinx® Zynq®-7000 All Programmable SoC. In support of PicoZed development and prototyping, Avnet is also releasing the PicoZed Carrier Card, which provides the necessary interfaces and access to user I/O from the PicoZed…

Seagate Completes Buy of LSI Units

Seagate Technology plc (NASDAQ: STX), a world leader in storage solutions, today announced it has completed its previously announced acquisition of the assets of LSI’s Accelerated Solutions Division (“ASD”) and Flash Components Division (“FCD”) from Avago Technologies Limited (NASDAQ:AVGO). “There is a growing opportunity for mobile and enterprise flash-based storage solutions, which is why we’re…