FCI & Samtec Sign Connector Sourcing Pact

FCI Electronics and Samtec Inc., two leading suppliers of high speed connectors and interconnect systems, today announced the signing of a second-source agreement under which Samtec is licensed to manufacture, market and sell FCI’s next generation ExaMAX® high speed connector product portfolio. Officials from both companies expressed their excitement in this new partnership. “This second-source…

Kemet & NEC Amend Option Agreement

KEMET Corporation (NYSE: KEM) (“KEMET”), a leading global supplier of electronic components, today announced that its wholly-owned subsidiary, KEMET Electronics Corporation (“KEC”), and NEC Corporation (“NEC”) have entered into an amendment to the parties’ March 12, 2012 Option Agreement. “This Amendment provides KEMET with additional flexibility in managing our capital structure,” stated Per Loof, Chief…

Broadcom Combo Chip Doubles Wi-Fi Performance

Irvine, Calif., — Broadcom Corporation (NASDAQ: BRCM), a global innovation leader in semiconductor solutions for wired and wireless communications, today announced the industry’s most powerful 5G WiFi (802.11ac) 2×2 Multiple Input Multiple Output (MIMO) combo chip for mobile devices. The BCM4358 delivers unparalleled throughput, Bluetooth co-existence performance and indoor location accuracy, enabling OEMs to design high-end…

China Capacitor Market to Reach $5.6 Billion in 2014

On the basis of dielectric material used, capacitors are categorized into ceramic, film, electrolytic, solid double layer, carbon, dielectric, and paper & plastic capacitors. Electrolytic capacitors are further classified into aluminum and tantalum electrolytic capacitors. Electronic capacitors are used in various end user applications such as Information & Communication Technology (ICT), consumer electronics, industrial, infrastructure,…

Avnet Releases PicoZed System-On-Module

Phoenix, Ariz. —Avnet Electronics Marketing, an operating group of Avnet, Inc. (NYSE: AVT) today released PicoZed™, its newest family of System-On-Modules (SOMs) based on the Xilinx® Zynq®-7000 All Programmable SoC. In support of PicoZed development and prototyping, Avnet is also releasing the PicoZed Carrier Card, which provides the necessary interfaces and access to user I/O from the PicoZed…

Seagate Completes Buy of LSI Units

Seagate Technology plc (NASDAQ: STX), a world leader in storage solutions, today announced it has completed its previously announced acquisition of the assets of LSI’s Accelerated Solutions Division (“ASD”) and Flash Components Division (“FCD”) from Avago Technologies Limited (NASDAQ:AVGO). “There is a growing opportunity for mobile and enterprise flash-based storage solutions, which is why we’re…

ISM: Manufacturing Surges in August

Economic activity in the manufacturing sector expanded in August for the 15th consecutive month, and the overall economy grew for the 63rd consecutive month, say the nation’s supply executives in the latest Manufacturing ISM® Report On Business®. The report was issued today by Bradley J. Holcomb, CPSM, CPSD, chair of the Institute for Supply Management®(ISM®)Manufacturing…

Mouser Inks Global Deal With Broadcom

– Mouser Electronics, Inc., a top design engineering resource and global distributor for semiconductors and electronic components, today announced that it has signed a global distribution agreement with Broadcom Corporation. As Broadcom’s first eCommerce distributor, Mouser Electronics will offer same-day shipping on a variety of Broadcom mass market products, including the industry-leading Wireless Internet Connectivity…

IPC Updates Two Key Standards

IPC — Association Connecting Electronics Industries® has released the F revisions of two of the industry’s most widely used standards, IPC J-STD-001, Requirements for Soldered Electrical and Electronic Assemblies, and IPC-A-610, Acceptability of Electronic Assemblies. The documents have been updated to include technical advances in solder on plastic surface mount (SMT) components, new criteria for…