FCI, TE Sign Second-Source Agreement for Mini I/O Connectors

Singapore — FCI, leading supplier of connectors and interconnect systems, announced an agreement with TE Connectivity* (TE), for Industrial Mini Input/Output (I/O) connector families, to establish the Industrial Mini I/O family in the market as the reliable Ethernet connector. “We are delighted having FCI as a second source for Industrial Mini I/O connectors” said Eric Leijtens,…

Samsung 128GB DDR4 Modules Available in Volume

Seoul, Korea – Samsung Electronics Co., Ltd., announced today that it is mass producing the industry’s first “through silicon via” (TSV) double data rate-4 (DDR4) memory in 128-gigabyte (GB) modules, for enterprise servers and data centers. Following Samsung’s introduction of the world-first 3D TSV DDR4 DRAM (64GB) in 2014, the company’s new TSV registered dual inline…

Renesas to Transfer Tsuruoka Factory to TDK

Tokyo, Japan – TDK Corporation (“TDK”, TSE: 6762), Renesas Electronics Corporation (“Renesas Electronics”, TSE: 6723), and Renesas Semiconductor Manufacturing Co., Ltd. (“Renesas Semiconductor Manufacturing”), a wholly owned subsidiary of Renesas Electronics, today announced that they signed a basic agreement on November 27, 2015 under which Renesas Semiconductor Manufacturing’s Tsuruoka Factory will be transferred to TDK.…

ABI Releases Intel Atom x3 Platform Teardown

Austin, Tex. — In its latest teardown report, ABI Research, a leader in technology market intelligence, discerns that the Intel® Atom™ x3 Platform, the company’s second integrated communication platform, includes the highest integration mobile platform transceiver to date. Code-named “SoFIA,” the platform series’ implemented innovation demonstrates the company’s departure from the norm in taking integration down a…

North American PCB Business Grows Slowly

Bannockburn, Ill. — IPC — Association Connecting Electronics Industries® announced today the October findings from its monthly North American Printed Circuit Board (PCB) Statistical Program. Modest sales growth continued in October and the book-to-bill ratio retreated to 1.02. Total North American PCB shipments increased 1.4 percent in October 2015 compared to October 2014. Year-to-date shipment growth continued…

Pericom OKs Diodes Bid

Pericom Semiconductor Corporation (“Pericom” or the “Company”) (NASDAQ: PSEM) announced today that, based on a preliminary count of the votes cast at the Company’s Special Meeting of Shareholders held this morning, Pericom shareholders have approved the previously announced Agreement and Plan of Merger between Diodes Incorporated (“Diodes”) (NASDAQ: DIOD) and Pericom (the “Agreement”). Based on…

Mouser Stocks Infineon S5 Series IGBTs

Mouser Electronics, Inc. is the first global distributor to stock the TRENCHSTOP™ 5 S5 insulated gate bipolar transistors (IGBTs) from Infineon. This new series in the ultra-thin wafer TRENCHSTOP 5 family boasts an industry-leading low typical saturation voltage of 1.60 VCE(sat) at 175 degrees Celsius, maintaining high efficiency even during high-temperature operations. The Infineon TRENCHSTOP…

Conexant Completes Audio Testing Facility in Taiwan

Irvine, Calif. – Having recently expanded its presence in Asia Pacific, Conexant Systems Inc., an audio and imaging innovation leader, today announced that it has completed the build out of its new AudioSmart™ test facility in Taipei’s Technology Corridor. By making a significant investment in this new acoustical engineering and test facility in Taipei, Conexant has more than doubled…

Qualcomm Names Cristiano Amon President of QCT

Qualcomm Incorporated (NASDAQ: QCOM) today announced that Cristiano Amon has been promoted to executive vice president, Qualcomm Technologies, Inc. and president of QCT, effective immediately. During Amon’s 18-year tenure, his leadership has been instrumental in driving revenue growth in the core business and now the expansion into adjacent areas. This promotion is a recognition of Amon’s unique…