Qorvo to Buy GreenPeak Technologies

Qorvo® (Nasdaq: QRVO), a leading provider of core technologies and RF solutions for mobile, infrastructure and defense applications, announced today that it has signed a definitive agreement to acquire privately-held GreenPeak Technologies, a leader in ultra-low power, short range RF communication technology. The acquisition of Netherlands-based GreenPeak will allow Qorvo to expand its customer offering to…

C&K Components Names New CEO

Newton, Mass. — C&K Components, a leading global manufacturer of electromechanical switches, smart card readers, and high-reliability connectors, has announced the appointment of John J. Boucher as chief executive officer. John Boucher brings more than 30 years of diversified experience with leading global companies within the high-tech electronics manufacturing and services segment to C&K. Boucher…

Bourns Releases Automotive Component Selection Guide

Riverside, Calif.- Bourns, Inc., a leading manufacturer and supplier of electronic components, has published a new Automotive Component Selection Guide that showcases the company’s breadth of AEC-Q200 qualified components.  In the latest short form brochure, Bourns lists its broad selection of AEC-Q200 products that include resistors and magnetics that condition and filter electronic circuits. Complementing…

New Materials Transform Capacitor into High Energy Storage Device

Menlo Park, Calif. – Capacitor Sciences has developed patent-pending materials to create nano-structured crystalline thin films. When used as the dielectric material in a capacitor, these materials create high performance capacitive energy storage cells that are capable of producing 10X the energy density and 100X the power density of lithium ion batteries, at a significantly…

Molex, Cisco Take MSA Lead on QSFP-DD Interfaces

At the Optical Fiber Communication (OFC) Conference in Anaheim, CA, Molex, LLC, and Cisco announced their participation in a multi-supplier agreement (MSA) to create high-speed, double-density quad small form factor pluggable (QSFP-DD), a new high-speed interface. Thirteen industry leaders have joined the MSA to collaborate in developing this new high-speed interface. “The need for high-speed solutions is…

TE Connectivity: Building a Conflict Minerals Infrastructure

Chicago, Ill. – Due to the new regulations and reform in the US, UK, EU, and APAC, supply chain due diligence and corporate social responsibility is a necessity for corporations. Companies are currently re-working their conflict minerals management programs in order to efficiently address SEC expectations. Enhancing smelter data and verification processes has become a major…

Kemet to Unveil New Ceramic Capacitor Dielectric

Greenville, S.C. – KEMET (NYSE: KEM) is to preview new multilayer ceramic capacitors (MLCCs) featuring its advanced U2J Class-1 dielectric technology at the 2016 IEEE Applied Power Electronics Conference and Exposition (APEC). The event will take place at the Long Beach Convention and Entertainment Center, California, from March 20-24 (Booth 1753, Hall C). Also displayed at…

MicroQSFP MSA Group Releases Spec Version 2.0

Anaheim, Calif. – The members of the microQSFP (micro Quad Small Form-Factor Pluggable) Multi-Source Agreement (MSA) group today announced that it has released the microQSFP Specification Version 2.0 allowing system designers, optical module manufacturers and copper cable assembly providers across the industry to develop next-generation hardware based on the microQSFP definition. The microQSFP document includes…