ISM: Procurement Savings Miss the Mark

 When OEMs began implementing practices such as just-in-time (JIT) and build-to-order (BTO), analysts began to look at the supply chain as a possible profit center rather than a cost. Yet, a survey conducted by the Institute of Supply Management indicates that procurement – one of the key functions in the supply chain – remains primarily…

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Shift Happens: Thoughts on Industry Change

Admittedly, when I saw that Avnet Electronics Marketing Americas president Ed Smith would give an “Unplugged” presentation at last fall's Electronic Components Industry Association Executive Conference, I smiled thinking someone had finally given Smith a mic and a standup slot. If you've had the pleasure of meeting Smith, two things are instantly clear about him:…

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Memoir Joins TSMC IP Alliance

Memoir Systems Inc., today announced that it has joined the TSMC Soft IP Alliance Program, leveraging TSMC’s advanced process technologies to improve power, performance and area for its Renaissance family of multiport memory IP. Using Memoir’s IP delivery platform that includes design-for-formal and exhaustive formal verification, Memoir delivered fully verified ultra-high performance multiport memory IPs…

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IPC Study Underway

IPC – Association Connecting Electronics Industries® released a global survey this month to collect data for the IPC International Technology Roadmap for Electronic Interconnections, and for IPC’s 2014 Technology Trends Study. Participation is open to all manufacturers of printed circuit boards and board assemblies worldwide. The deadline for survey responses is January 31. The survey covers…

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Fairchild Goes Global With RS Components

RS Components( http://www.rs-components.com ) (RS), the trading brand of Electrocomponents plc( http://www.electrocomponents.com ) (LSE:ECM), the world’s leading high service distributor of electronics and maintenance products, has secured a franchised distribution deal with Fairchild Semiconductor, a leading global supplier of high performance power and mobile semiconductor solutions. The terms of the agreement license RS to represent…

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ARM and UMC Ink IP Pact

ARM and UMC (NYSE:UMC; TWSE:2303), a leading global semiconductor foundry, today announced an agreement to offer the ARM® Artisan® physical IP platform along with POP™ IP for UMC’s 28nm high-performance low-power (HLP) process technology. To support customers targeting a wide range of consumer applications such as smartphone, tablet, wireless and digital home, UMC and ARM…

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