Avnet Names Lou Lutostanski as VP, IoT

Avnet (NYSE: AVT), a leading global technology distributor, today announced the promotion of Lou Lutostanski to the role of vice president of Internet of Things (IoT), effective immediately. Lutostanski will report directly to Pete Bartolotta, chief transformation officer for Avnet. In his new role, Lutostanski will strengthen Avnet’s IoT strategy and further Avnet’s reach to makers,…

Details

Power Adapter Regulations – Comparing DoE Level VI and CoC Tier 2

  The successive laws mandating higher average efficiencies in external power supplies have undoubtedly had a significant impact on global power consumption over the past decade. However, ensuring that your external power supply is up-to-date with the dynamic regulatory environment has become a complex task.When the United States Department of Energy (DoE) implemented its Level…

Details

Advanced MP Inks Distribution Deal with GAPTEC

Advanced MP Technology has announced their newly signed distribution agreement with GAPTEC Electronic, a leader in innovative low energy consumption products. GAPTEC Electronic specializes in DC-DC and AC-DC voltage transformers, supplying a selected range of transformers with typical insulation and industrial voltages as well as currently common terminal pin assignments. GAPTEC’s extensive product offering list,…

Details

ST Teams with Wurth Elektronik on Power Supply Design

STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, is extending the focus of its eDesignSuite online design environment with the addition of complementing components from Wurth Elektronik, a major transformer[1] manufacturer, to help customers complete their new projects more quickly and cost-effectively. More and more electronic product design is done online…

Details

ECIA Approves New Directors

ECIA welcomes new executives to the ECIA Executive Committee and various boards of directors: the Association, the ECIA Foundation, and the EDS Board. “Executive volunteers such as these fine individuals are the lifeblood of our association.  We are deeply grateful for their willingness to share their time and talent,” commented John Denslinger, ECIA CEO and president. “This year…

Details

Murata to Buy Arctic Sand

Peregrine Semiconductor Corporation, a full subsidiary of Murata (Headquarters: San Diego, California, USA) and Arctic Sand Technologies, Inc. (Headquarters: Burlington, Massachusetts, USA) today announced that they have entered into a definitive agreement of acquisition on March 15, 2017. Purpose of the acquisition Arctic Sand Technologies is a manufacturer engaged in the design and sale of…

Details

Coilcraft Releases Power Inductor Selection Tool

Coilcraft has launched a new suite of Power Inductor Selection Tools that allows users to easily select the appropriate path for their particular search while also providing more application-specific performance data than previously available on any industry site. Len Crane, Coilcraft’s Director of Technical Marketing, will be previewing the tool this week at the Applied Power Electronics…

Details

U.S. power electronics industry technology roadmap

U.S. Power Electronics Industry Faces Big Challenges

Advances in semiconductor technologies, capacitors, magnetics and packaging are needed to drive growth in the U.S. power electronics industry, according to a new report from the Power Electronics Industry Collaborative (PEIC). It will also require collaboration in the supply chain and ecosystem to advance the domestic power electronics industry. While the need for innovation in semiconductors…

Details

TTI Europe Stocks Molex Picoflex Connectors

Highly reliable power and signal Molex Picoflex® connectors are now available in Europe through TTI, Inc., a world leading specialist distributor of electronic components.  Tested to meet the requirements of high-vibration and shock environments found in a wide number of industrial, consumer and automotive products, Molex Picoflex® connectors have a space-saving, robust package which suits…

Details