Portland, Ore. – Today, the Open Interconnect Consortium (OIC) announced it would be acquiring substantially all of the assets of the UPnP Forum. In exchange, OIC will offer membership to UPnP Forum members. The agreement will streamline and consolidate efforts around both organizations’ technologies and infrastructure, leading to increased alignment on standardization for the Internet of…
DetailsMouser Electronics, Inc. is now stocking the MCP9600 thermocouple EMF to temperature converter from Microchip Technology. The MCP9600 is the first thermocouple-conditioning integrated circuit to combine precision instrumentation, a precision temperature sensor and a precision, high-resolution analog-to-digital converter (ADC), in addition to a math engine preprogrammed with the firmware to support a broad range of…
DetailsSingapore — FCI, leading supplier of connectors and interconnect systems, announced an agreement with TE Connectivity* (TE), for Industrial Mini Input/Output (I/O) connector families, to establish the Industrial Mini I/O family in the market as the reliable Ethernet connector. “We are delighted having FCI as a second source for Industrial Mini I/O connectors” said Eric Leijtens,…
DetailsSeoul, Korea – Samsung Electronics Co., Ltd., announced today that it is mass producing the industry’s first “through silicon via” (TSV) double data rate-4 (DDR4) memory in 128-gigabyte (GB) modules, for enterprise servers and data centers. Following Samsung’s introduction of the world-first 3D TSV DDR4 DRAM (64GB) in 2014, the company’s new TSV registered dual inline…
DetailsTokyo, Japan – TDK Corporation (“TDK”, TSE: 6762), Renesas Electronics Corporation (“Renesas Electronics”, TSE: 6723), and Renesas Semiconductor Manufacturing Co., Ltd. (“Renesas Semiconductor Manufacturing”), a wholly owned subsidiary of Renesas Electronics, today announced that they signed a basic agreement on November 27, 2015 under which Renesas Semiconductor Manufacturing’s Tsuruoka Factory will be transferred to TDK.…
DetailsAustin, Tex. — In its latest teardown report, ABI Research, a leader in technology market intelligence, discerns that the Intel® Atom™ x3 Platform, the company’s second integrated communication platform, includes the highest integration mobile platform transceiver to date. Code-named “SoFIA,” the platform series’ implemented innovation demonstrates the company’s departure from the norm in taking integration down a…
DetailsBannockburn, Ill. — IPC — Association Connecting Electronics Industries® announced today the October findings from its monthly North American Printed Circuit Board (PCB) Statistical Program. Modest sales growth continued in October and the book-to-bill ratio retreated to 1.02. Total North American PCB shipments increased 1.4 percent in October 2015 compared to October 2014. Year-to-date shipment growth continued…
DetailsSeoul, Korea – LG Display, the world’s leading innovator of display technologies, announced today that it will invest KRW1.84 trillion to begin building a new panel plant in Paju, Gyeonggi Province, Korea, with production expected to commence in the first half of 2018. The company decided on the new plant, known as P10, because of anticipated…
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The electronics industry — in fact, most industries — acknowledge that the supply chain must be resilient. In order to accomplish this, however, businesses themselves have to have resilience embedded in their infrastructure and practices. But only 29 percent of CEOs polled by the British Standards Institution (BSI) and The Economist Intelligence Unit (EIU) believe they…
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There’s much to be said about the spate of consolidations this year, to be sure, as EPS’ Bolaji Ojo recently discussed; there are real industry changes afoot. Certainly, much of the transactional strategies have to do with the views into new market positions, and the opportunities to scale and refine oligopolies — among other competitive…
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