Sunnyvale, Calif. – Osram Opto Semiconductors has released the Oslon Black SFH 4713A, an infrared LED (IRED) with a wavelength of 850 nanometers (nm). The SFH 4713A is designed for near-range illumination from 10 to 50 meters (approx. 30 to 200 feet), targeting security applications including camera surveillance of public spaces, company premises, and entrances…
DetailsFountain Inn, S.C. – AVX Corp. has introduced a new series of tantalum polymer capacitors designed to provide small, high energy, low profile solutions for solid-state drive (SSD) applications. Touting low ESR and the highest energy per volume (Joules/cc) of any comparable SMT capacitor currently available on the market, the new J-CAP Series solid tantalum…
DetailsSeoul, Korea – Samsung Electronics Co., Ltd. added three TCO-optimized, high-performance SSDs, based on 3-dimensional (3D) Vertical NAND (V-NAND) technology, to its portfolio of advanced enterprise and data center SSDs. Designed for OEMs, the PM1633, PM1725 and PM953 SSDs are available in a range of interfaces and form factors based on Samsung’s proprietary 3-bit MLC V-NAND flash…
DetailsSidney, N.Y. – Amphenol Industrial Products Group releases SurLok Plus, a high current cabling system designed for energy storage in commercial and residential battery storage systems as well as electric and hybrid electric vehicles. SurLok Plus, used by inverter and power supply manufacturers, is optimized for battery pack connections from 50 A to 400 A using a touch-safe…
DetailsIrvine, Calif. — Toshiba America Electronic Components, Inc. (TAEC), has developed the new generation of BiCS FLASH, a three-dimensional (3D) stacked cell structure flash memory. Touted as the industry’s first 256-gigabit (32 gigabyte) 48-layer BiCS FLASH device, it also uses 3-bit-per-cell TLC (triple-level cell) technology. Toshiba defines the stacked cell structure as “a structure stacking Flash memory cells…
Details
Another major disaster –the chemical explosion in the northeastern Chinese city of Tianjin, roughly 75 miles East of Beijing –has recently resulted in a significant loss of life. The blast occurred “[…] at a warehouse owned by Rui Hai International Logistics, a private company that was licensed to handle hazardous cargo,” according to the New…
DetailsTokyo, Japan – Toshiba Corporation claims the development of the industry’s first 16-die (max.) stacked NAND flash memory using Through Silicon Via (TSV) technology. The prototype uses TSV technology that uses the vertical electrodes and vias to pass through the silicon dies for the connection. “This enables high speed data input and output, and reduces power consumption,” said…
DetailsFort Myers, Fla. – Crystek Corporation launched the CCPD-575, an ultra-low phase noise LVPECL Oscillator that provides a -162 dBc/Hz noise floor. The clock oscillator claims an industry leading phase noise for an LVPECL oscillator – at least 15 dB lower phase noise than most LVPECL oscillators on the market today. Other key specs include close-in phase noise @ -90…
DetailsSunnyvale, Calif. — eInfochips® has announced that Arrow Electronics, Inc. will offer the Eragon600 Development Kit, System-on-Module, and Design Services for companies to design products and systems based on the Qualcomm® Snapdragon™ 600 processor. The Snapdragon 600 processor is a product of Qualcomm Technologies, Inc., a subsidiary of Qualcomm Incorporated. Engineers can shorten development time, reduce design risk…
DetailsCork, Ireland—Excelsys Technologies has added PMBus communications on its Xsolo series of 1U, single-output power supply units (PSUs). The Xsolo units, equipped with an optional I2C digital interface, can be remotely monitored by system supervisory equipment using industry standard PMBus protocols. The Xsolo family is offered in a convection-cooled, 504W open-frame U-channel form-factor model (6.8W/in3) and an…
Details