CES – Las Vegas – Broadcom Corporation has expanded its portfolio of 5G Wi-Fi chips and system-on-chip (SoC) devices for mass market retail routers, wireless cable/DSL/PON gateways and set-top boxes (STBs). The new 802.11ac offerings enable OEMs to design products that meet consumer demand for streaming HD content wirelessly across multiple devices in the home, said…
DetailsCES – Las Vegas – Toshiba America Electronic Components, Inc. (TAEC) has introduced the TC7765WBG wireless power receiver controller IC for wireless charging of tablet devices. Managing the 12-watt power transfer necessary for wireless charging of tablets, and compatible with the Qi low-power specification version 1.1 defined by the Wireless Power Consortium (WPC), the TC7765WBG offers a comparable…
DetailsAnother year, another counterfeiter. The United States Attorney for the District of Connecticut announced in December that component distributor Jeffrey Warga, 61, of North Kingstown, R.I., waived his right to indictment and pleaded guilty before a U.S. District Judge in Hartford to one count of conspiracy to commit wire fraud. What is particularly notable about this…
DetailsCES – Las Vegas — At the 2015 International Consumer Electronics Show (CES), Broadcom Corporation (NASDAQ: BRCM), a global innovation leader in semiconductor solutions for wired and wireless communications, announced a range of new innovations optimized to enhance connectivity in the home, on-the-go and on-the-road. New product announcements include the world’s first DOCSIS 3.1 offering, new…
DetailsLisle, Ill. – Molex Incorporated, a leading global interconnect and cable assembly provider, announced that it and certain of its affiliates have acquired SDP Telecom. Headquartered in Montreal, Canada, SDP designs and manufactures RF/microwave solutions for the wireless communications industry. “Together, Molex and SDP will broaden our RF/Microwave product capabilities and create additional value for our customers…
DetailsThe new RGB LED Lighting Shield with XMC1202 for Arduino from Infineon Technologies is now available for purchase from element14, a global electronics distributor and online community for design engineers and hobbyists. The RGB LED Lighting Shield with XMC1202 for Arduino is one of the industry’s first easy-to-use, intelligent lighting solutions compatible with Arduino and…
DetailsRFMW, Ltd. announces the availability of a new White Paper from TriQuint (Qorvo) titled GaN Thermal Analysis for High-Performance Systems. This paper addresses the TriQuint (Qorvo) integrated approach to thermal design that leverages modeling, empirical measurements (including micro-Raman thermography), and finite element analysis (FEA) for high performance microwave GaN HEMT devices and MMICs. This methodology…
DetailsPortland, Ore. — According to a new report by Allied Market Research titled, “Global 3D Camera Market – Size, Industry Analysis, Trends, Opportunities, Growth and Forecast, 2013 – 2020”, the global 3D Camera market is expected to reach$7,661.8 million by 2020, registering a CAGR of 39.4% during 2014 – 2020. The 3D camera applications, in smartphones,…
DetailsSeoul, South Korea — NEXCOM has released the NISE 3720 series industrial IoT gateways and controllers for smart manufacturing. Supporting 5th generation Intel® Core™ processors, the NISE 3720 series provides enhanced computing and graphics capabilities. Adding the support for cross-protocol communication capability, the NISE 3720 series connects factories, enabling intensive data analysis of a data…
DetailsCES – Las Vegas – Imagination Technologies (IMG.L) announces a new PowerVR imaging framework for Android: a set of software components that allow OEMs to integrate the latest computational photography and computer vision features into their camera applications, leveraging the inherent low-power parallelism of the PowerVR Rogue GPU. Advanced vision and computational photography features such as HDR…
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