SEGGER Awards Rutronik

In recognition of its exceptional revenue and growth performance, Rutronik Elektronische Bauelemente GmbH has received the “Distributor of the Year 2016” award from SEGGER Microcontroller GmbH & Co. KG. “Rutronik is our solution provider – customers expect comprehensive and professional service from a single source. This is precisely what sets our partnership apart and what…

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Massive Sensor Fusion for Cars Is HERE

PARIS — Digital mapmaker HERE — owned by three leading German automakers BMW, Audi and Daimler — is planning the 2017 launch of new crowd-sourced data services based on sensory data collected from luxury cars. HERE will provide both the driver and the car’s assisted-driving system with services that range from “HERE Hazard Warnings” and…

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Mouser, Oplink Sign Global Agreement

Mouser Electronics, Inc., the global authorized distributor with the newest semiconductors and electronic components, today announced it has entered into a global distribution agreement and partnership with Oplink Communications, a Molex company and a leading provider of optical communication components, intelligent modules, and subsystems. Oplink’s product line, now available from Mouser Electronics, adds advanced solutions…

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Exposing the Biggest Hidden Supply Chain Cost of a New Facility

When deciding between locations for a new facility, most companies embark upon supply chain network studies that thoroughly evaluate each potential geography. Property leases, labor costs, and administrative costs are all important factors in weighing the differences between geographies. However, one extremely important cost is often calculated using incomplete or inaccurate data: transportation.  This is…

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TSMC Expands its 3D Menu

SAN JOSE, Calif. – Taiwan’s largest semiconductor kitchen released its latest menu, a 3D matrix that spans process, packaging and applications-specific options. TSMC described at an event here FinFET processes down to 7nm it will serve up over the next few months as well as an expanding set of 3D packaging options. “We are getting…

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