Milpitas, Calif. – Linear Technology Corp. has launched the LTC2983 high performance digital temperature measurement IC, which directly digitizes RTDs, thermocouples, thermistors and external diodes with 0.1°C accuracy and 0.001°C resolution. The analog front end offers low noise, low offset buffered ADCs, and all the necessary excitation and control circuits for each sensor. The measurements are performed…
DetailsPulse Electronics Corporation (OTC Pink: PULS), a leading provider of electronic components, today announced that its Board of Directors has named Mark Twaalfhoven as Chief Executive Officer, effective immediately. Mr. Twaalfhoven also has been appointed to Pulse’s Board of Directors, expanding the Board from six to seven members and John E. Major has been named…
DetailsChandler, Ariz. — Microchip Technology Inc. has announced a new family of 16-bit dsPIC33 digital signal controllers (DSCs). The dsPIC33 “EV” family provides 5-V operation for improved noise immunity and robustness, which is suited for devices operating in harsh environments such as automotive (including sensors, user interface, fuel pumps, cooling fans and water pumps), appliance (including…
DetailsGeneva – STMicroelectronics has introduced its new M-Series of 1200-V IGBTs that feature advanced trench-gate field-stop technology. The new design is said to save more energy and increase reliability in applications such as solar inverters, welding equipment, uninterruptible power supplies, and industrial motor drives. With highly optimized conduction and turn-off characteristics, as well as low…
DetailsRFMW, Ltd. announces design and sales support for Carlisle Interconnect Technologies SMA Precision Swept Right Angle Adapters. Carlisle Interconnect Technologies features a continuous right-angled design to produce optimally matched low loss adapters for 50 Ohm applications with low VSWR and Insertion loss and tested per MIL-STD-202. Different connector options are available for use in designs…
DetailsCurrent memory technologies such as DDR, both the compute variety (DDR3 / DDR4); and the mobile variety, (LPDDR3/LPDDR4); are expected to reach the end of their road soon, according to market research firm Yole Développement. Thus several new DRAM memory architectures based on 3D layer stacking and through silicon via (TSV) have evolved to carry…
DetailsHong Kong — Lenovo smart bracket product successfully passed the TUV Rheinland Smart Wearable Device Certification and was awarded the world’s first Smart Wearable Device Certification. Mr. Uwe Halstenbach, Vice President & Managing Director, TUV Rheinland Greater China Electrical, Mr.Eric Yu, Executive Director & GM, Lenovo Accessories & Service Upsell Business Unit, and Mr.Ray Zhuo Executive Director…
DetailsSeoul, South Korea — LG Electronics (LG) today announced the appointment of new executives to lead the LG Home Entertainment and LG Mobile Communications companies and the merger of its Home Appliance and Air Conditioning & Energy Solution business units to create a consolidated LG Home Appliance & Air Solution (H&A) Company. All new appointments…
DetailsIrvine, Calif. — Toshiba America Electronic Components, Inc. (TAEC) has extended its LETERAS family of white LEDs with the launch of its TL1L3 series for industrial LED lighting.The new series features ultra-compact devices that combine gallium nitride-on-silicon (GaN-on-Si) chips with an industrial standard 3535 lens type package. While high-performance white LEDs are typically fabricated on expensive sapphire substrates…
DetailsEl Segundo, Calif. – The global market for industrial semiconductors is forecast to increase by 12.9 percent in 2014, reaching $38.5 billion, up from $34.0 billion in 2013, according to IHS Technology. This is up from an increase of 11.4 percent growth in 2013. The growth is attributed to “continuing strength in China and a resurgent U.S.…
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