San Jose, Calif. — Cadence Design Systems, Inc. (NASDAQ: CDNS), a leader in global electronic design innovation, today announced the industry’s first MIPI® SoundWireSM Controller Intellectual Property (IP). SoundWire is a new digital audio interface specification from the MIPI Alliance that enables bi-directional digital communication with a focus on low complexity and low gate count, making it…
DetailsScottsdale, Ariz. (October 9, 2014) – NKK Switches, the world’s leading designer and manufacturer of innovative electromechanical switches, today outlined a suite of switch solutions to meet the needs of design engineers in the audio/video broadcast market. As the primary user interface, switches help to control the various elements of audio, video and other broadcasting…
DetailsOakland, Calif. – Digicom Electronics, Inc., a technology and quality driven electronics manufacturing services (EMS) company, announces that the white paper, What Medical Device Companies Need to Consider in Selecting an EMS Company, is now available on the Digicom Electronics website at www.digicom.org/selecting-ems-company.html. The article discusses the factors that contribute to a successful contract electronics manufacturing relationship and the…
DetailsElizabeth, N.J. – Alpha Wire will head to Munich, Germany in November for Electronica 2014, the world’s largest electronic trade fair. Throughout the fair, Alpha Wire will be displaying their tough Pro-Tekt line of cables, the latest in LSZH heat-shrink tubing, and the ever-growing EcoGen line of wire and cable. Alpha Wire will be featuring the newest addition to the…
DetailsAliso Viejo, Calif.– Microsemi Corporation (Nasdaq: MSCC), a leading provider of semiconductor solutions differentiated by power, security, reliability and performance, today announced the availability of its new ultra secure SmartFusion2® SoC FPGAs and IGLOO2® FPGAs that have more advanced security features at the device, design and system levels than any other leading FPGA manufacturer. The new data…
DetailsSunnyvale, Calif.– Spansion Inc. (NYSE: CODE), a global leader in embedded systems solutions, and Integrated Silicon Solution, Inc. (NASDAQ: ISSI), a leader in advanced memory solutions, today announced plans to develop HyperRAM™ products based on the Spansion HyperBus™ interface, which dramatically improves performance while reducing the number of pins. Both companies will have rights to sell…
DetailsHsinchu — ChipMOS TECHNOLOGIES (Bermuda) LTD. (“ChipMOS” or the “Company”) (NASDAQ: IMOS), an industry leading provider of outsourced semiconductor assembly and testing services (“OSAT”), today reported its unaudited consolidated revenue for the month of September 2014and third quarter ended September 30, 2014. Revenue for the third quarter of 2014 was NT$5,806.3 million or US$190.7 million, representing an increase of 7.3%…
DetailsHsinchu, Taiwan — The Board of Directors of United Microelectronics Corporation (UMC) (NYSE: UMC; TWSE: 2303), a leading global semiconductor foundry, today resolved to participate in a 3-way agreement for a joint venture company focused on 12″ wafer foundry services with Xiamen Municipal People’s Government and FuJian Electronics & Information Group. Based on the agreement, UMC…
DetailsBoxborough, Mass. – Manufacturers of audio/video (A/V), information technology (IT) and communication technology products need to know that CENELEC has accepted a new standard IEC 62368-1 as a mandatory requirement for CE marking of low-voltage equipment sold in the European Union (EU). IEC 62368-1 will replace two standards currently in use – EN 60065 for…
DetailsSunnyvale, Calif. — AMD (NYSE: AMD) today announced that its board of directors has appointed Dr. Lisa Su as president and chief executive officer and member of the board of directors, effective immediately. Dr. Su, 44, succeeds Rory Read, 52, who has stepped down as president and chief executive officer, and member of the board of directors, as part…
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