Aliso Viejo, Calif. — Microsemi Corporation (Nasdaq: MSCC), a leading provider of semiconductor solutions differentiated by power, security, reliability and performance, today announced the availability of the company’s new largest density, lowest power SmartFusion®2 150K LE System-on-Chip (SoC) FPGA Advanced Development Kit. Board-level designers and system architects can quickly develop system-level designs by using the two…
DetailsArrow Electronics, Inc., and Advantech have announced that they will be jointly hosting an Internet of Things Seminar for original equipment manufacturers that will not only be informative about the hottest growth area in technology but will also provide practical advice on how to take advantage of this new wave of connectivity. In addition to…
DetailsIPC’s Validation Services Program has awarded an IPC J-STD-001 and IPC-A-610 Qualified Manufacturers Listing (QML) to Hunter Technology Corp., an electronics design and manufacturing services firm based in Milpitas, Calif. The facility successfully completed an intensive audit based on two of IPC’s foremost standards: IPC J-STD-001, Requirements for Soldered Electrical and Electronic Assemblies and IPC-A-610,…
DetailsSanta Clara, Calif. — OmniVision Technologies, Inc. has launched the OVM6211 CameraCubeChip, a complete global shutter camera solution in the industry’s smallest form factor. The OVM6211 enables a variety of applications in consumer devices, including key machine and computer vision capabilities such as gesture recognition, eye tracking and motion detection. The camera solution targets advanced applications…
DetailsGreenville, S.C. — KEMET Corporation has introduced a new line of High Temperature Radial Molded Multilayer Ceramic Capacitors, which offer industry-leading performance in extreme environments and high temperature up to 200 degrees Celsius. These capacitors can withstand the severe shock and vibration conditions associated with deep-well and horizontal drilling activities, and are also well-suited for use in geophysical probes,…
DetailsWellington, New Zealand — RS Components (RS), the trading brand of Electrocomponents plc (LSE:ECM), the global distributor for engineers, has signed a significant distribution agreement with Adapteva, producer of the innovative Epiphany multicore coprocessor and developer of the popular Parallella-16 board. The partnership will bring the Parallella board directly to customers in Europe and Asia, which comprise…
DetailsWashington — As Unmanned Aerial Vehicles – or drones – become more commercially available and the list of industries utilizing the technology expands, companies should be aware of the stringent transportation regulations applicable to the lithium ion batteries that power virtually every UAV. These transportation regulations address the packaging, testing and size limitations (in Watt-hours and…
DetailsElectronica 2014 Hall A5, Stand 261 FTDI Chip has long been regarded as synonymous with USB innovation and the company continues to introduce new semiconductor products that are helping engineers implement better designs. The FT4222H is the latest addition to its expansive USB offering. Compliant with the USB 2.0 hi-speed standard, this is a feature-rich…
DetailsOperational visibility – knowing where a shipment is and monitoring the environmental conditions in near real-time of cargo in-transit – is becoming an important tool for the supply chain and the transportation industries, according to a new survey of shippers and logistics providers conducted by eyefortransport (eft) in conjunction with AT&T. One way to gather…
DetailsRare earth elements (REEs) differ significantly from conflict minerals in all but one aspect: their availability—or lack thereof—has the potential to disrupt the electronics supply chain. REEs are exactly as they sound: compounds that appear in nature that are scarce or difficult to mine. Conflict minerals – also natural elements – are concentrated in regions…
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