Georgia Tech, Finetech Demo New Copper Interconnect
Gilbert, Ariz. – Finetech, a global supplier of high accuracy bonding and advanced rework equipment, was selected by the Georgia Tech Packaging Research Center (PRC) to provide it’s semi-automatic Matrix bonder to demonstrate the first manufacturable, low-temperature, ultra-fine pitch copper interconnections and assembly technology. The new Georgia Tech patented technology enables, for the first time,…
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