HABEY USA, a leading manufacturer of embedded computer and a Freescale Connect Partner, announces The HIO Project, an open hardware project to enable developers and users to have access to an affordable Freescale i.MX6 ARM Cortex A9 Processor based open architecture platform. The core component of the HIO Project is the HIO Mainboard, model…
DetailsDallas, Tex. — Texas Instruments (TI) has expanded the availability of tiny package sizes to several new families of ultra-low-power MSP430 microcontrollers (MCUs). This enables the design of smaller products with TI’s ultra-low-power FRAM-based MSP430FR5738 and Flash-based MSP430F51x2 MCUs in wafer-level chip scale packages (WLCSP) as small as 2.0 x 2.2 x 0.3 mm, in…
DetailsSan Jose, Calif. — Econais Inc. claims the industry’s smallest, smartest and most integrated Wi-Fi (SiP) module for smart home, M2M, and Internet of Things (IoT) device designs. The WiSmart EC19W01 802.11b/g/n Wi-Fi system-in-package (SiP) module is housed in a 14- x 16- x 2.8-mm footprint that fully integrates the microcontroller, Wi-Fi, cloud connectivity, Flash,…
DetailsIselin, N.J. – TDK Corp. extends its range of EPCOS MKK power capacitors with new higher density parts, targeting traction converters and HVDC systems. The MKK DCI-R B2640* series with resin impregnation is based on the MKK DC series with gas impregnation and the MKK DC-I with oil impregnation. The energy density of the resin-impregnated…
DetailsHoneywell (NYSE: HON) today announced several senior leadership changes, reflecting further advancement of strong leaders throughout the Company, effective immediately. “Honeywell is in an enviable position to capitalize on the strength and experience of a highly capable leadership team to support our continued strong performance and commitment to our customers and shareholders,” said Honeywell Chairman…
DetailsSan Jose, Calif. — Altera Corp. offers a new power conversion solution that makes it easy for board developers to design point-of-load power solutions, while achieving the highest FPGA performance at the lowest system power, according to the company. The power conversion solution is a monolithic 40A driver plus synchronous MOSFET powertrain that is optimized…
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Many government initiatives are passed with the best of intentions but with unintended results. In the U.S., small to mid-size manufacturing companies will be spending more on healthcare requirements this year than on expansion and new product development. PrimeAdvantage, a purchasing consortium of small to midsize companies, surveyed its members about their financial expectations for 2014…
DetailsFreescale Semiconductor (NYSE:FSL), a global leader in embedded processing solutions and the number one provider of communications processors for networking equipment, has entered into a definitive agreement to purchase the Comcerto® CPE communications processor business of Mindspeed Technologies, Inc. This business includes a series of multicore, ARM®-based embedded processors and associated software, a talented team,…
DetailsEl Segundo, Calif. — The demand for machines in manufacturing sectors such as agriculture, packaging, materials handling, and machine tools will drive revenues to $1.6 trillion in 2014, up from $1.5 trillion in 2013, according to a new report from IHS Technology. The annual growth of 6.3 percent this year is more than twice the…
DetailsKEMET Corporation (NYSE: KEM), a leading global supplier of electronic components, presented its most recent product performance results for polymer tantalum capacitors developed according to the Automotive Electronics Council (AEC) Q200 Reliability Document at the 2014 CARTS International Conference in Santa Clara, CA. The presentation included the results of high temperature and high humidity testing…
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