IPC Joins NextFlex

Bannockburn, Ill. — IPC — Association Connecting Electronics Industries® has become a partner of NextFlex, America’s flexible hybrid electronics manufacturing institute, which is based in Mountain View, Calif. As part of the National Network for Manufacturing Innovation (NNMI), this new public-private partnership aims to establish America as the global leader in the flexible hybrid electronics manufacturing space.…

Details

Midsized Manufacturers Expect to Outpace Market

Financial executives of small and mid-sized U.S. manufacturing businesses are optimistic about their growth prospects for 2016, according to research from the buying consortium PrimeAdvantage. At the same time, CFO confidence in the U.S. economy has fallen from last year with slightly more than half of executives – 54 percent — expressing optimism. This is…

Details

Microsemi OTN Processor in Mass Production

Aliso Viejo, Calif. — Microsemi Corporation (Nasdaq: MSCC), a leading provider of semiconductor solutions differentiated by power, security, reliability and performance, today announced its DIGI-G4, the company’s latest DIGI Optical Transport Network (OTN) processor enabling the transition to 400G OTN switching solutions is available in mass production. With multiple carriers’ trials underway, Microsemi is enabling the industry to…

Details

MIT Spin-Off Secures Financing Led by Murata

Cambridge, Mass. – Arctic Sand Technologies (www.arcticsand.com), the performance and space saving leader in power conversion ICs has announced the completion of a $19M Series B Financing round, led by Murata Manufacturing Company, Ltd. with co-investors  GE Ventures, Northwater Capital and Arsenal Venture Partners. Targeting major segments of the $5B DC/DC power conversion market, Arctic Sand’s ICs today…

Details

Gather RH, Temperature & Pressure Data with Wireless Sensor Dev Board from TE Connectivity — Now Available from Mouser

Mouser Electronics, Inc. is pleased to announce the availability of the MEASwireless sensor development board from TE Connectivity (TE), a global leader in connectivity and sensors. The board reports relative humidity, temperature and barometric pressure through Bluetooth 4.0 connectivity, providing environmental data for evaluating weather stations, HVAC systems, and other industrial applications. The development board…

Details

IPC Releases Global Policy Framework, Announces Dates for “IMPACT Washington, D.C. 2016”

BANNOCKBURN, IL – The world's leading advocate for the electronics industry today released its Global Policy Framework for 2016, and announced the dates of its major U.S. public policy advocacy event of the year, coming up in April.  IPC – Association Connecting Electronics Industries, headquartered in the United States, is a global industry association representing…

Details