Intel Corp. is in a quandary. The PC sector is flagging, its efforts in mobile communications haven’t paid up quite as expected and the fledging Internet of Things market is still too young to show robust sales. Can the world’s No. 1 semiconductor company find salvation in the foundry business, making custom chips for fabless…
DetailsContour Semiconductor, Inc., a provider dedicated to producing the world’s lowest-cost, high-volume, non-volatile memory chips, today announced that it has appointed veteran semiconductor industry executive Saul Zales as Chief Executive Officer. Zales will lead Contour’s development of next generation non-volatile chips, addressing the $25 billion NAND flash memory market opportunity with a technology that is…
DetailsRambus Inc. (NASDAQ:RMBS), the innovative technology solutions company that brings invention to market, today reported financial results for the first quarter ended March 31, 2014. GAAP Financial Results: Revenue for the first quarter of 2014 was $78.3 million, up 7% on a sequential basis from the fourth quarter of 2013 primarily due to increased revenue…
DetailsGLOBALFOUNDRIES today announced that Toshiba Corporation will join the company’s GLOBALSOLUTIONS ecosystem of partners. As a worldwide ASIC partner, Toshiba will enable its Fit Fast Structured Array (FFSATM) and ASIC solutions based upon GLOBALFOUNDRIES’ technologies and services for customers across the globe. The agreement includes participation on multi-project wafer (MPW) runs and production wafers covering…
DetailsRS Components ( http://singapore.rs-online.com/web ) (RS), the trading brand of Electrocomponents plc( http://www.electrocomponents.com ) (LSE:ECM), the world’s leading high service distributor of electronics and maintenance products, has enhanced its passive components offering with the introduction of a range of RS brand Multi-Layer Ceramic Capacitors ( http://singapore.rs-online.com/web/c/passive-components/capacitors ) (MLCCs) in standard 7″ or 13″ reel quantities.…
DetailsAvnet Electronics Marketing, an operating group of Avnet, Inc. (NYSE: AVT), today released the Industrial MicroZed™ System-on-Module (SOM), the MicroZed Cost-Optimized (CO) SOM and the MicroZed Single Board Computer (SBC). This expands on the existing MicroZed portfolio, which previously consisted of MicroZed 7010 and MicroZed 7020 SOMs, as well as the MicroZed 7010 Evaluation Kit.…
DetailsGlobal electronic components distributor Digi-Key Corporation, the industry leader in electronic component selection, availability and delivery, today announced its continued efforts around sustainability and environmental management. The company has put into place a series of green initiatives including ISO 14001:2004 certification, environmentally friendly packaging, company-wide policies and best practices around reducing energy, waste, and paper…
DetailsArrow Electronics, Inc., (NYSE:ARW) today announced that it has certified its São Paulo,Brazil, facility to several quality and environmental industry standards for electronics asset disposition. It is the first South American location certified to the R2 Responsible Recycling standard. In addition to R2, the facility holds the following certifications: Recycling Industry Operating Standard Occupational Health…
DetailsAltera Corporation (NASDAQ: ALTR) and TSMC (TWSE: 2330, NYSE: TSM) today announced the two companies have worked together to bring TSMC’s patented, fine-pitch copper bump-based packaging technology to Altera’s 20 nm Arria 10 FPGAs and SoCs. Altera is the first company to adopt this technology in commercial production to deliver improved quality, reliability and performance…
DetailsXilinx, Inc. (NASDAQ: XLNX) and Open-Silicon, Inc., both founding developer members of the Hybrid Memory Cube Consortium (HMCC), today announced Hybrid Memory Cube (HMC) controller IP for Xilinx Virtex(R)-7 FPGAs. The high-performance nature of Virtex-7 FPGAs enables system developers to take advantage of the ultra-high memory bandwidth of the Hybrid Memory Cube and utilize the…
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