Chenbro Expands Joint Development Initiative

Enclosure solutions can make or break computer performance, and, for the past three decades, leading enclosure solution provider Chenbro has been partnering with the industry’s leading OEMs and ODMs for customized solutions with end user needs in mind. Now, Chenbro is expanding its joint development manufacturing initiative to include system integrators and solution providers who are…

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RS Components & Fairchild Offer Reference Designs

RS Components( http://singapore.rs-online.com/web ) (RS), the trading brand of Electrocomponents plc( http://www.electrocomponents.com ) (LSE:ECM), the world’s leading high service distributor of electronics and maintenance products, and Fairchild Semiconductor (NASDAQ: FCS), a leading global supplier of high performance power and mobile semiconductor solutions, have collaborated to create a set of complete reference designs for seven of…

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HIO Project Underway

HABEY USA, a leading manufacturer of embedded computer and a Freescale Connect Partner, announces The HIO Project, an open hardware project to enable developers and users to have access to an affordable Freescale i.MX6 ARM Cortex A9 Processor based open architecture platform.   The core component of the HIO Project is the HIO Mainboard, model…

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TI Extends Small Packaging to MSP430 MCUs

Dallas, Tex. — Texas Instruments (TI) has expanded the availability of tiny package sizes to several new families of ultra-low-power MSP430 microcontrollers (MCUs). This enables the design of smaller products with TI’s ultra-low-power FRAM-based MSP430FR5738 and Flash-based MSP430F51x2 MCUs in wafer-level chip scale packages (WLCSP) as small as 2.0 x 2.2 x 0.3 mm, in…

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Econais Claims Smallest, Smartest Wi-Fi Module

San Jose, Calif. — Econais Inc. claims the industry’s smallest, smartest and most integrated Wi-Fi (SiP) module for smart home, M2M, and Internet of Things (IoT) device designs. The WiSmart EC19W01 802.11b/g/n Wi-Fi system-in-package (SiP) module is housed in a 14- x 16- x 2.8-mm footprint that fully integrates the microcontroller, Wi-Fi, cloud connectivity, Flash,…

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Honeywell Announces Executive Changes

Honeywell (NYSE: HON) today announced several senior leadership changes, reflecting further advancement of strong leaders throughout the Company, effective immediately. “Honeywell is in an enviable position to capitalize on the strength and experience of a highly capable leadership team to support our continued strong performance and commitment to our customers and shareholders,” said Honeywell Chairman…

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