Samsung Electronics Co., Ltd., the world leader in advanced memory technology, said today that it is accelerating its production ramp up of DDR4 memory modules to accommodate an anticipated strong market demand along with the approaching introduction of the new Intel® Xeon®™ processor E5-2600 v3 product family. DDR4 is the most advanced memory for server…
DetailsEnclosure solutions can make or break computer performance, and, for the past three decades, leading enclosure solution provider Chenbro has been partnering with the industry’s leading OEMs and ODMs for customized solutions with end user needs in mind. Now, Chenbro is expanding its joint development manufacturing initiative to include system integrators and solution providers who are…
DetailsCML Microcircuits, is pleased to announce the establishment of a Systems Group within CML Microcircuits (UK) Ltd. Formerly known as Applied Technology Ltd, Systems Group is an engineering organisation specialising in performance RF design and DSP software. Based in Somerset it continues the tradition of RF and DSP technology established in the area by the…
DetailsRS Components( http://singapore.rs-online.com/web ) (RS), the trading brand of Electrocomponents plc( http://www.electrocomponents.com ) (LSE:ECM), the world’s leading high service distributor of electronics and maintenance products, and Fairchild Semiconductor (NASDAQ: FCS), a leading global supplier of high performance power and mobile semiconductor solutions, have collaborated to create a set of complete reference designs for seven of…
DetailsMaster Electronics announced today the acquisition of Electro Sonic. Electro Sonic is a Canadian electronic and electrical distributor and has been serving the Canadian market for over 60 years. Electro Sonic will continue under the Electro Sonic name going forward. Electro Sonic has formed tight knit relationships with over 150 suppliers and thousands of customers since…
DetailsHABEY USA, a leading manufacturer of embedded computer and a Freescale Connect Partner, announces The HIO Project, an open hardware project to enable developers and users to have access to an affordable Freescale i.MX6 ARM Cortex A9 Processor based open architecture platform. The core component of the HIO Project is the HIO Mainboard, model…
DetailsDallas, Tex. — Texas Instruments (TI) has expanded the availability of tiny package sizes to several new families of ultra-low-power MSP430 microcontrollers (MCUs). This enables the design of smaller products with TI’s ultra-low-power FRAM-based MSP430FR5738 and Flash-based MSP430F51x2 MCUs in wafer-level chip scale packages (WLCSP) as small as 2.0 x 2.2 x 0.3 mm, in…
DetailsSan Jose, Calif. — Econais Inc. claims the industry’s smallest, smartest and most integrated Wi-Fi (SiP) module for smart home, M2M, and Internet of Things (IoT) device designs. The WiSmart EC19W01 802.11b/g/n Wi-Fi system-in-package (SiP) module is housed in a 14- x 16- x 2.8-mm footprint that fully integrates the microcontroller, Wi-Fi, cloud connectivity, Flash,…
DetailsIselin, N.J. – TDK Corp. extends its range of EPCOS MKK power capacitors with new higher density parts, targeting traction converters and HVDC systems. The MKK DCI-R B2640* series with resin impregnation is based on the MKK DC series with gas impregnation and the MKK DC-I with oil impregnation. The energy density of the resin-impregnated…
DetailsHoneywell (NYSE: HON) today announced several senior leadership changes, reflecting further advancement of strong leaders throughout the Company, effective immediately. “Honeywell is in an enviable position to capitalize on the strength and experience of a highly capable leadership team to support our continued strong performance and commitment to our customers and shareholders,” said Honeywell Chairman…
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